Large-scale investment in generative AI infrastructure is driving a sharp increase in data center power consumption. According to IEA estimates, global data center electricity consumption is expected to exceed 400 TWh in 2025, up from approximately 220 TWh in 2022. For data center operators where energy costs represent 30–40% of operating expenses, even a few percentage points of improvement in power conversion efficiency translates directly into billions of yen in annual cost savings. This rising bar of requirements is significantly raising the specifications for power devices used in PSUs (power supply units) and UPS (uninterruptible power supplies).
To put the scale in perspective, GPU racks equipped with AI accelerators in the H100/H200 class can draw 50–100 kW per rack in some configurations. Compared to conventional general-purpose server racks (5–10 kW), power density has increased by more than tenfold. As a result, demand is surging for a complete redesign of the entire power conversion infrastructure — including incoming power equipment, UPS, and PSUs — to handle high power density.
The Scale of the Power Surge — How Much Has It Grown?
The primary driver of this surge is the mass deployment of GPU clusters for generative AI. Major cloud operators — Microsoft, Google, Meta, and Amazon — executed data center investments on the order of hundreds of billions of yen during 2024–2025, and this trend is expected to continue through 2026 and beyond. NVIDIA's next-generation GPUs (post-Blackwell) are pushing power density even higher, with the design ceiling for power infrastructure being rewritten every two years.
In Japan, domestic data center development is also accelerating under the government's policy to strengthen the AI and semiconductor industry base. Large-scale DC investments are underway in Hokkaido (leveraging surplus power near the TSMC site), Kumamoto, Osaka, and Kyushu, driving a corresponding expansion in domestic demand for power equipment. Hokkaido in particular benefits from the combination of cold-climate cooling cost advantages and renewable energy, making it a preferred location for large-scale GPU-focused data center construction.
Concrete Changes in Power Device Requirements
Data center power conversion follows a multi-stage conversion path: utility grid → transformer → UPS → switchboard → PDU → PSU → voltage regulator (VR) → processor. Because losses accumulate at each conversion stage, improving overall conversion efficiency requires performance improvements in power devices at every stage.
Higher Efficiency PSUs (Power Supply Units)
Achieving 80 PLUS Titanium grade or above (efficiency exceeding 96%) is becoming a standard requirement for server PSUs. GaN MOSFET adoption is expanding in the down-conversion stage from the 48V intermediate bus to 12V/5V, with designs operating above 1 MHz switching frequency becoming mainstream. This improves output power density and reduces the size and weight of the PSU itself.
SiC Adoption in UPS (Uninterruptible Power Supplies)
Three-phase inverters using SiC are becoming standard in large UPS systems. Compared to conventional silicon IGBTs, conversion efficiency improves by 2–3%, delivering an ROI that translates to hundreds of millions of yen in annual energy cost savings. Thermal design can also be simplified by leveraging SiC's high-temperature operating characteristics, contributing to equipment miniaturization and reduced cooling costs.
48V Power Bus and Intermediate Bus Conversion
The 48V DC power architecture promoted by OCP (Open Compute Project) standardization is rapidly gaining adoption. Transmission losses are lower than with the conventional 12V bus, enabling the same amount of power to be delivered through thinner wiring. Demand for 48V-compatible GaN and SiC devices is surging, and manufacturers with existing 12V design assets face urgent pressure to transition their product portfolios.
The 48V Power Architecture in Detail — The Core of Design Change
The 48V DC power architecture led by OCP (Open Compute Project) is approaching de facto standard status in data center design among major cloud operators. The technical rationale: for the same delivered power, a 48V architecture requires only one-quarter the current of a 12V architecture, reducing resistive losses in wiring and connections by a factor of sixteen (P = I²R).
This transition significantly changes power device design requirements. While silicon MOSFETs optimized for low voltage and high current were the dominant choice in 12V systems, GaN-on-Si and GaN-on-SiC MOSFETs are increasingly being adopted in the 48V → 12V conversion (POL: Point of Load) stage. GaN MOSFETs in the 40–65V breakdown voltage class from EPC, Navitas, and GaN Systems are optimized for this application, enabling significant size reduction compared to silicon devices of equivalent die area.
GaN Adoption in POL Conversion (48V → 12V/5V)
POL conversion stages require operation at high switching frequencies (1–3 MHz), where GaN MOSFETs' low switching losses are highly effective. Navitas's monolithic GaN chips with integrated gate drivers simultaneously reduce PCB area and component count.
SiC Adoption in Input-Side PFC Circuits
PFC (power factor correction) circuits have become essential for improving data center power quality, and SiC adoption in Totem-Pole PFC configurations is expanding. SiC-based PFC circuits can achieve conversion efficiency exceeding 99% in some implementations, enabling a directly calculable ROI in energy cost reduction.
Design Changes for Liquid-Cooled and Immersion-Cooled PSUs
The shift to liquid cooling and immersion cooling fundamentally changes PSU enclosure design and insulation specifications. Components in direct contact with liquids must be compatible with insulating oils, which also affects the selection of power device encapsulants. Demand for immersion cooling-compatible PSUs is expected to surge between 2026 and 2028.
Supplier Landscape — Who Will Capture This Demand?
For GaN-on-Si PSU devices, EPC (Efficient Power Conversion), Navitas Semiconductor, and GaN Systems (now under Infineon) have emerged as leading suppliers. For SiC UPS applications, Wolfspeed, STMicroelectronics, Rohm Semiconductor, and onsemi have established customer bases.
Japanese power supply manufacturers (Sanyo Denki, TDK, Cosel, etc.) hold meaningful market positions in data center PSUs and UPS systems and are in the process of transitioning to GaN and SiC devices. However, as procurement volumes for GaN and SiC devices surge, supply tightness for GaN devices in particular has become partially visible, increasing the need for long-term procurement contracts.
The pace of specification change in the data center segment is rapid — designs from two years ago can already be obsolete. Confirming with suppliers whether they have a roadmap for compatibility with next-generation GPUs is an effective way to contain design revision costs.
Procurement Implications — Can Supply Keep Pace with Change?
Roadmap for Next-Generation GPU Power Density
NVIDIA Blackwell/Rubin, AMD next-gen GPUs, and Google next-gen TPUs are each expected to deliver 1.5–2x the power density of current products. Verify whether suppliers have a design change plan for PSUs and UPS systems that can accommodate these requirements. Products unable to meet specifications two years out will require redesign.
Stable Supply Capacity for GaN and SiC Devices
Surging demand for data center GaN/SiC is already causing supply tightness on some part numbers. For critical power device part numbers, the key evaluation criteria for supply stability is whether suppliers have secured wafer purchase contracts and inventory buffers.
Compatibility with Thermal Design and Cooling Methods
The shift to next-generation cooling methods such as liquid cooling and immersion cooling also changes the mechanical design requirements for PSUs and UPS. Looking ahead to the demand ramp from 2025–2026 onward, verify in advance whether suppliers have a track record in liquid cooling-compatible PSU design.
Connecting Data Center Power Demand to Renewable Energy Procurement
Major cloud operators (Microsoft, Google, Meta, Amazon) have committed to RE100 and carbon neutrality targets, meaning the surge in data center power demand is simultaneously creating large-scale demand for renewable energy. From a power device perspective, this creates a synergistic effect in which demand for solar and wind power conversion (PCS) and data center power supply demand expand simultaneously.
In Japan, plans for large-scale DC campus construction in Hokkaido, Kyushu, and the Chubu region are materializing between 2025 and 2026, making these facilities an important domestic demand source for domestic power equipment and power module manufacturers. The domestic power supply market for data centers is projected to grow at an annual rate of 15–20%, in contrast to the volatility of the EV-focused SiC market, characterized by more stable and predictable growth.
Power device demand for data centers is one of the few high-growth segments that will expand steadily as long as AI infrastructure investment continues. Unlike the fluctuations in EV-driven demand, this demand is supported by large-scale capital expenditure from cloud operators and is highly predictable. Incorporating the acceleration of SiC and GaN adoption in this segment into supplier competitive assessments is becoming increasingly important.
