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Sector analysis of market structure, technology shifts, and corporate strategy — grounded in verified facts.

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Data Center Power · News

PJM's Grid Rules for AI Data-Center Large Loads

PJM, one of the largest US grid operators, is building rules to reliably connect large loads such as AI data centers. It announced an integration plan in January 2026 and, on February 27, filed at FERC to extend the capacity-auction price collar and expedite interconnection. It offers bring-your-own-generation and an expedited track. We map this new phase of grid constraints with primary sources.

datacenter-power PJM grid

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News

Samsung SDI Takes Full Control of the GM Battery JV

Samsung SDI acquired GM's 49.99% stake in the SynergyCells JV, its first wholly owned plant in North America. Slower-than-expected EV demand was the direct reason; the New Carlisle, Indiana plant ($3.5B, 27–36 GWh) pivots to ESS. Samsung SDI and GM continue joint development of next-gen prismatic cells. We map the battery-supply reshuffle with primary sources.

EV Market ev-market battery

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Li Auto Starts First Overseas Production in Kazakhstan

Li Auto signed an MOU with the Allur Group on July 16, 2026 for local assembly of its L-series in Kostanay, Kazakhstan. On July 20, it unveiled the new Li L9 in Almaty, marking its first market launch outside China.

EV Market Li Auto Kazakhstan

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GM, SAIC Extend China JV to 2047

Per China's State Council Information Office, GM and SAIC Motor extended their China joint venture through 2047. SAIC GM plans over 30 NEV models by 2030, and Buick Electra E7 begins its first overseas exports in October 2026. SAIC Motor has produced 100 million vehicles cumulatively.

EV Market GM SAIC

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Power Integrations Hits Industry-First 2200V GaN

Power Integrations announced on August 5, 2026 the industry's first 2200V-rated PowiGaN technology. Target applications span AI data center 1500V distribution, EV auxiliary power, and solar inverters — moving GaN into voltage territory long dominated by SiC.

Power Semiconductors GaN PowiGaN

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Nextpower Completes Zigor Power Deal

Nextpower completed its acquisition of Zigor's power conversion business and Apex Power's assets on July 30, 2026. It plans to ramp US manufacturing across multiple sites, starting deliveries in early 2027 and targeting over 10GW online within 12 months.

Power Semiconductors Nextpower Zigor

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SSBJ Handbook Revised on Partial Compliance

Japan's Sustainability Standards Board (SSBJ) revised its handbook on disclosure when not fully complying with SSBJ standards to Ver. 2.0 on July 31, 2026, prompted by a May advisory. The handbook is not the SSBJ standard itself and carries no legal force.

Sustainability SSBJ disclosure

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India-EU FTA Sets Up CBAM Annexure

The India-EU FTA concluded in January 2026, covering a combined $24 trillion market with 99.5% of India's exports gaining preferential access. Reports say it also includes a dedicated CBAM annexure covering EU-approved verification bodies and SME capacity building.

Sustainability CBAM India

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Global EV Sales Rebound 35% in Q2

Per an official IEA report, global EV sales rose 35% quarter-on-quarter and 4% year-on-year in Q2 2026, with growth in over 90 countries in H1. US sales fell 25% y-o-y as a tax credit ended, while over 1 million exported Chinese EVs remain unaccounted for as sales.

EV Market IEA EV sales

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RIR Power's India-First SiC Vertical Push

RIR Power Electronics, founded in 1969, rebranded in September 2025 as India's first vertically integrated SiC semiconductor maker. It is building a SiC power campus in Odisha with INR 6.18 billion in investment, listed on the NSE in July 2026, and targets FY2027 mass production.

Power Semiconductors RIR Power Electronics SiC

Practical Guide

800VDC Rollout: Vertiv, Foxconn Lead the Way

NVIDIA's 800VDC rollout timeline: Vertiv ships products in H2 2026, Foxconn leads deployment at its Kaohsiung K-1 site, and Kyber racks ship in 2027.

Data Center Power 800VDC data center

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DOE transmission study: data centers redraw the grid map

DOE has published a draft 2026 National Transmission Needs Study that identifies data centers, manufacturing expansion, and large industrial loads as key causes of transmission constraints. U.S. data-center electricity use is projected to rise from 176TWh, or 4.4% of total power, in 2023 to 325–580TWh and as much as 12% by 2028. This article maps a grid bottleneck that is becoming as material as semiconductors.

Data Center Power DOE transmission

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Navitas and Magnachip: 3300V SiC licensing

On July 23, 2026, Navitas announced it will license GeneSiC Gen4/Gen5 technology, covering 1200V, 2300V, and above 3300V, to Magnachip. Magnachip will transfer and localize the technology at its Korean fab. The target is high-voltage grid infrastructure, industrial electrification, and energy storage rather than EVs, showing SiC competition broadening from automotive into power and industrial markets.

Power Semiconductors Navitas Magnachip

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STMicroelectronics Q2 2026: double-digit SiC growth and DC upside

STMicroelectronics reported Q2 2026 revenue of USD 3.49 billion, up 26% year on year, with a 34.8% gross margin. It expects double-digit SiC revenue growth in 2026, supported by the move from 6-inch to 8-inch wafers, and raised its AI data-center targets to over USD 1 billion in 2026 and over USD 2 billion in 2027. Q3 guidance is USD 3.70 billion and Q4 is expected to exceed USD 4 billion.

Power Semiconductors STMicroelectronics SiC

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EFRAG: SME ESRS consultation

In July 2026, EFRAG opened a public consultation on sustainability-disclosure standards for SMEs. The pillars are VSME, a voluntary standard for companies outside CSRD, and LSME for listed SMEs, effective from January 2026 with a two-year relief period. The standards aim to reduce the burden on mid-sized and small suppliers receiving Scope 3 demands from larger companies through a common format.

Sustainability EFRAG ESRS

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GaN patent war: Infineon ITC win and Wolfspeed suit

Infineon secured a final U.S. ITC import and sales ban against Innoscience GaN products, the first large case in which European IP excludes Asian products from the U.S. market. Wolfspeed also sued Navitas for patent infringement, turning GaN patent battles into procurement risk.

Power Semiconductors GaN power semiconductors

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The Geopolitics of Advanced Packaging: US CHIPS and the EU

Advanced packaging becomes a focus of national strategy. The US Commerce Department finalized $1.4 billion for advanced packaging via the CHIPS NAPMP, and Amkor invests ~$2 billion in Arizona (up to $400M in subsidies). The EU targets a 20% global share by 2030 under the European Chips Act and proposed a Chips Act 2.0 in June 2026. We map the US–EU policy race with primary sources.

Advanced Packaging advanced packaging geopolitics

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SiC solid-state transformers: AIDC deployment begins

SiC solid-state transformers (SSTs) have entered the commercial stage. Weiguang Energy has shipped more than 100 SSTs and secured over 40GW of capacity across two sites. Delta has announced an SST delivering MW-class power in 1m² with more than 50% space savings, while Eaton offers its 2.5MW MV SST 2.0. This article reviews the move to direct conversion from medium voltage to 800VDC using primary information.

Power Semiconductors SiC solid-state transformer

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AI compute now hinges on power: from FLOPS to MW

AI supercomputing is shifting from performance in FLOPS to power and efficiency. TOP500 leader LineShine reached 2.198 EF at 42.2 MW with a CPU-only design, while Microsoft Fairwater points to distributed AI superfactories. Primary data shows the move from FLOPS to megawatts.

Data Center Power data center AI

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SiC investment: EU approves EUR 659M, China raises capital

On July 14, 2026, the European Commission approved EUR 659 million in state aid for four semiconductor facilities in Germany. Element 3-5 receives EUR 353 million for SiC epitaxial wafers and Vishay EUR 214 million for a power-MOSFET plant. In China, AccoPower (芯聚能) and Xinyueneng (芯粤能) reportedly raised more than RMB 700 million in a Series D round. Public and private capital is accelerating into SiC supply chains in Europe and China.

Power Semiconductors SiC EU Chips Act

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CATL: deploy 5GWh of sodium-ion storage in Europe

CATL and Dutch company Alfen signed an MOU to deploy 5GWh of Tener Sodium, a sodium-ion BESS, in Europe. It supports more than 30MWh, 1% self-consumption, and RTE about 2% higher than LFP. China will tax lithium-ion batteries at 2% while exempting sodium-ion and solid-state batteries through the end of 2028. This article examines commercialization and policy moving together.

EV Market sodium-ion CATL

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The Hybrid Bonding Equipment Race

Chiplet density is decided by bonding technology. Applied Materials developed the industry's first integrated die bonder with Besi and took a 9% stake to deepen ties. SÜSS MicroTec is launching the world's first platform integrating W2W/D2W in one cluster. We map the US–Europe-led frontier of copper direct bonding (hybrid bonding) with primary sources.

Advanced Packaging advanced packaging hybrid bonding

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India Semiconductor: CG Semi Starts OSAT Production

CG Semi began commercial production at its G1 OSAT facility in Sanand, Gujarat, on July 4, 2026. The site can produce up to 300 million units per year, with more than ₹76 billion planned for G1 and G2 over five years.

Power Semiconductors power semiconductors India

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New York: pause on new DCs above 50MW

On July 14, 2026, New York issued the first U.S. pause on state environmental permits for new hyperscale data centers above 50MW, for up to one year. About 12GW of data-center load is queued at NYISO. The previous day, Meta announced an expansion of Hyperion to 5GW and more than USD 50 billion. This article examines a U.S. market where regulation and expansion now proceed at once.

Data Center Power data center regulation

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Power semis: Infineon expands, onsemi sells fabs

Infineon opened one of the world's largest power semiconductor fabs in Dresden on July 2, 2026, with EUR 5 billion of investment and about 1,000 jobs, while onsemi is selling two fabs under Fab Right. Primary sources show how expansion and asset-light restructuring are diverging.

Power Semiconductors power semiconductors Infineon

Practical Guide

Liquid cooling operating requirements

As liquid cooling becomes a baseline for AI servers, designers need operational requirements, not just cooling-method selection. This article reviews TCS loop pressure of 140-450kPa, ASHRAE coolant classes W1-W5, IEC 62368-1 leak testing, and sensor requirements.

Data Center Power liquid cooling data center

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ABF Substrates: AT&S and IBIDEN Ramp Up

ABF/IC substrates, tight with AI demand, enter a major ramp. AT&S agreed with AMD and others, repurposing its Kulim plant and doubling capex from €0.4B to €1.0–1.2B, while lifting its revenue outlook to 45–55%. IBIDEN commits ~¥500 billion over three years. We map the substrate supply that underpins advanced packaging with primary sources.

Advanced Packaging advanced packaging ABF substrate

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China-made EVs and Europe

China-made EVs are gaining global presence. IEA says they accounted for 15% and more than 900,000 EVs sold in advanced economies in 2025, and could exceed one in four by 2035. Europe also reached a 20% BEV share in January 2026.

EV Market EV China

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CoWoS/2.5D Packaging: TSMC vs Intel

TSMC's CoWoS (2.5D) underpins AI accelerator performance and is expanding to automotive qualification, System-on-Wafer in 2027, and COUPE (CPO) in 2026. Intel is consolidating Foveros volume production, EMIB, and ASAT at Fab 9. We map the shift of the main battleground to back-end packaging with primary sources.

Advanced Packaging advanced packaging CoWoS

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The Rise of Glass Substrates: Intel and SKC

Organic substrates approach their scaling limit by the end of the decade. The next move is glass. After a decade of research, Intel heads toward the 2030s, raising interconnect density and multi-chiplet integration with ultra-low flatness. SKC (Absolics) completed the world's first volume facility in Georgia, USA — 40% faster, with a $75M subsidy. We map the next-gen substrate for AI back-end.

Advanced Packaging advanced packaging glass substrate

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HBM4: Supply Chain and JEDEC Standard

SK hynix completed HBM4 development in September 2025, doubling bandwidth, improving power efficiency by 40%, and adopting 2,048 I/O. The JEDEC standard JESD270-4 defines 2 TB/s and 32 channels. Micron ramps 2.8 TB/s, 36GB 12H in 2026 and samples 48GB 16H. We map the supply chain and standard for HBM4, the star of AI memory.

Advanced Packaging advanced packaging HBM

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SiC/GaN 2026: China OEM demand

After the impairment cycle, SiC/GaN is shifting on both demand and technology. onsemi is supplying EliteSiC for NIO's 900V move and Geely's SEP system, partnering with Innoscience on GaN, while Toshiba and ROHM add new driver and cooling packages.

Power Semiconductors power semiconductors SiC

Practical Guide

NERC and AI large-load grid rules

NERC has identified computing loads, including data centers, crypto assets, and hydrogen electrolysis, as posing reliability issues distinct from conventional industrial loads. With 50MW blocks changing in 250ms and standards planned by end-2026, thresholds, requirements, and timing are becoming central to site strategy.

Data Center Power NERC large load

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EU adopts revised ESRS

The European Commission adopted revised ESRS in July 2026, cutting mandatory data points by more than 60% and expected reporting costs per company by over 30%. It also introduced a voluntary standard for SMEs outside the CSRD scope, reflecting EFRAG technical advice and stakeholder input.

Sustainability ESRS CSRD

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BYD June 2026: Exports Hit 40% of Sales

BYD's June 2026 NEV sales rose 5.5% to 403,472 units, with exports at 175,349 - over 40% of sales - as H1 domestic sales fell 15.7%.

EV Market BYD NEV

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FERC Starts DC Large-Load Reform

FERC issued a large-load interconnection ANOPR in October 2025 and plans action by June 2026 after reviewing more than 3,500 pages of comments. PJM summer peak demand is projected to rise 70GW over 15 years.

Data Center Power grid interconnection data center

Practical Guide

CATL's 500Wh/kg 'Solid-State' Condensed Battery

CATL's Condensed Battery, often called solid-state, reaches 500Wh/kg and is headed for automotive-grade mass production after RMB80bn in R&D.

EV Market solid-state battery CATL

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Na-ion Cell Proven Li-ion-Class

Cell Reports Physical Science analyzed mass-produced Hina sodium-ion cells in June 2026. Across 120 cells, impedance variation was 5.3%, discharge energy exceeded 80% at -20C, and commercial 18650 cells reached 110Wh/kg.

EV Market sodium-ion battery

Practical Guide

OCP Data Center Liquid Cooling Standards Explained

OCP is standardizing data-center liquid cooling - cold plates, CDU, UQD connectors, coolants - with NVIDIA, Meta, Dell, and Intel involved.

Data Center Power liquid cooling OCP

Practical Guide

Western EV Market Shifts

Western EV markets differ: Tesla's U.S. share fell from 60% to 38%, the U.K. ZEV mandate requires 22% BEV/FCEV, and HEV leads in the EU.

EV Market EV market ZEV mandate

Practical Guide

Practical Guide to Power Semiconductors for Grid Stabilization: STATCOM, HVDC, FACTS

A comprehensive overview of power semiconductors for STATCOM and HVDC systems, which are seeing increased demand due to renewable energy integration. Covers Mitsubishi Electric's ±450MVAr track record, Infineon's 4500V IGBT modules, LCC vs. VSC technology selection, and procurement insights.

Power Semiconductors STATCOM HVDC

Practical Guide

DC Metrics: PUE and WUE

A guide to data center efficiency metrics: The Green Grid's PUE, WUE, Partial PUE, waste heat reuse, and the xUE family including PUE/WUE/CUE.

Data Center Power PUE WUE

Practical Guide

U.S. Connected Vehicle Rule

The U.S. connected vehicle rule took effect on March 17, 2025, bans China/Russia VCS parts, sets MY2027/MY2030 deadlines, and has $1M penalties.

EV Market connected vehicle supply chain

Practical Guide

Practical Guide to Power Semiconductors for Water Electrolysis: Green Hydrogen and SiC/IGBT

An overview of power electronics for water electrolysis systems in green hydrogen production. Explains the adoption of MW-class SiC, grid code compliance, onsemi/Infineon PFC/DC-DC solutions, and insights on CAPEX/OPEX.

Power Semiconductors Green Hydrogen Water Electrolysis

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SBTi: Corporate Net-Zero Standard V2.0 Released

On June 11, 2026, the Science Based Targets initiative (SBTi) released the revised Corporate Net-Zero Standard V2.0. It abandons a one-size-fits-all approach for multiple target-setting options and an implementation hierarchy, imposes phased responsibility for ongoing emissions on large companies, and strengthens implementation transparency.

Sustainability SBTi Net Zero

Practical Guide

Emerging EV Markets and Chinese Cars

China held over 70% of global EV production and about two-thirds of sales in 2024. Brazil is over 85% Chinese cars, while Thailand uses EV 3.5.

EV Market EV market China NEV

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Global EV split: China and EU

In 2025, China's NEV share topped 51.6% of new cars and exports rose 90.4% year on year. In the EU, BEV share is rising toward 19.7% in 2026, while duties on Chinese BEVs reach up to 35.3%. This article organizes the bifurcation of the global EV market using primary sources.

EV Market EV market China NEV

Practical Guide

Global EV Market Size to 2030

Global EV sales topped 17 million in 2024 and are expected to exceed 20 million in 2025, with the share projected above 40% by 2030.

EV Market EV market market size

Practical Guide

48V vs 400V vs 800V DC for AI Racks

Compare 48V, +/-400V, and 800V DC for AI data-center racks by current, losses, power density, OCP direction, and procurement risk.

Data Center Power 800VDC power architecture

Practical Guide

Data Center Transformers: 120-Week Lead Times Explained

Primary sources explain why transformer lead times delay AI data-center energization. Large transformer lead times doubled from about 50 weeks in 2021 to an average 120 weeks in 2024, prices rose 80%, and one U.S. manufacturer disclosed a five-year wait for new orders. CISA, DOE, and NERC show the three barriers: custom production, interconnection queues, and new large-load rules.

Data Center Power transformer grid interconnection

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CBAM Strengthening: EU Council Agrees on Downstream Expansion

On June 12, 2026, the Council of the EU agreed to extend the Carbon Border Adjustment Mechanism (CBAM) to certain downstream products and to strengthen anti-circumvention measures. Following the December 2025 Commission proposal, Parliament's plenary adoption is expected in September 2026, with final legislation likely in late 2026 to 2027.

Sustainability CBAM EU

Practical Guide

800V DC Data-Center Power: Pros and Cons

Quick evaluation guide to 800V DC power for AI data centers: efficiency gains, fewer PSUs, density benefits, DC protection, and sourcing risks.

Data Center Power 800VDC data center

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Data centers: energy-system integration

AI data centers are adding onsite generation, BESS, and demand response as grid-only power becomes constrained.

Data Center Power data center energy storage

Practical Guide

DLC vs. immersion: data-center liquid cooling

A quick guide to data-center liquid cooling, split into direct liquid cooling(DLC/direct-to-chip) and immersion cooling(single-phase and two-phase). It explains cold-plate local heat removal, dielectric immersion, applicability, maintenance differences, and selection criteria based on primary and academic sources.

Data Center Power liquid cooling data center

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Liquid Cooling and Data-Center Power

As high-density AI racks shift toward liquid cooling, cooling choices reshape power supplies, SiC/GaN devices, Tj margins, and efficiency.

Data Center Power liquid cooling data center

Practical Guide

OCP Diablo: sidecar power racks

OCP's Diablo sidecar power-rack concept moves from in-rack 48V DC to ±400/800V DC to support 100kW to 1MW AI racks.

Data Center Power OCP 800VDC

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800V DC Power Shift for AI Data Centers

800V DC power for AI data centers: NVIDIA's 1MW-rack roadmap, up to 5% efficiency gains, DC protection hurdles, and supplier timing.

Data Center Power data center 800VDC

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Data centers: transformer and grid bottlenecks

AI data-center bottlenecks are moving to power infrastructure. EPRI projects 9-17% of U.S. electricity by 2030 and up to 10 years to energization.

Data Center Power data center grid

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onsemi: full-range GaN push

onsemi's GaNEXUS pairs 650V GaN with GlobalFoundries and 40-200V GaN with Innoscience, with H1 2026 samples for AI data-center power.

Data Center Power GaN onsemi

Practical Guide

EV Charging Semis: OBC and DC Fast Charging

SiC/GaN adoption is accelerating for OBCs and DC fast charging. Covers 30% loss cuts, 50% density gains, 800V migration, V2X, and ASIL-D safety.

Power Semiconductors OBC EV charging

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Wolfspeed: Gen 5 SiC Cuts Specific On-Resistance up to 27%

On June 9, 2026, Wolfspeed announced its fifth-generation SiC technology, reducing specific on-resistance (RSP) by up to 27% versus competing 1200V solutions. Covering 1200V/750V on a production-ready 200mm platform, it targets automotive traction inverters, industrial power supplies, and EV charging infrastructure.

Power Semiconductors Wolfspeed SiC MOSFET

Practical Guide

AQG 324 Automotive Qualification Guide

AQG 324 test requirements for humidity, power cycling, thermal shock and vibration, plus SiC MOSFET qualification hurdles and OEM demands.

Power Semiconductors AQG324 Automotive Power Module

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ESG Acronyms: Quick Guide

A practical guide to 55 sustainability acronyms, including CBAM, SSBJ, TCFD, TNFD, and ESRS, organized across eight areas with formal names, legal status, timing, and manufacturing impact.

Sustainability Sustainability ESG

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IGBT vs SiC MOSFET: How They Differ and Which to Choose

How do IGBTs and SiC MOSFETs differ, and which should you choose for a given application? This guide covers device structure (bipolar vs. unipolar), conduction and switching losses, voltage and frequency ranges, cost, and application-by-application selection across EV, industrial, solar, and data center power.

Power Semiconductors IGBT SiC MOSFET

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NBIM Urges One Report for ESRS and ISSB

NBIM, the manager of Norway's $2 trillion sovereign wealth fund, has asked the EU to allow companies to meet ESRS and ISSB, including IFRS S1/S2, in one report. ISSB has been adopted in 42 jurisdictions covering about 60% of global GDP.

Sustainability ISSB ESRS

Practical Guide

TNFD Recommendations Practical Guide: LEAP Approach and Disclosure Practices

A practical guide organizing the TNFD's four-pillar structure, the LEAP approach (Locate/Evaluate/Assess/Prepare), value chain disclosure, and integration with SBTs for Nature.

Sustainability TNFD Nature-related Risks

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India Semiconductor: OSAT and Design Onshore

Tata is building India's first semiconductor assembly and test facility, TSAT, in Jagiroad, Assam, with an investment of Rs 27,000 crore, or more than $3 billion. After ramp-up, it is expected to produce up to 48 million chips per day and support more than 27,000 jobs.

Power Semiconductors India Semiconductor OSAT

Practical Guide

EU Taxonomy Regulation Practical Guide: 4 Criteria, 6 Objectives, and Disclosure Obligations

A practical guide covering the 4 taxonomy-eligibility criteria, 6 environmental objectives, disclosure obligations for turnover/CapEx/OpEx, and the delegated act schedule of Regulation (EU) 2020/852.

Sustainability EU Taxonomy Green Finance

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CDP Adds Ocean to Environmental Disclosure

Starting the week of June 15, 2026, CDP will add ocean as its sixth disclosure theme after climate, forests, water, biodiversity, and plastics. With about 90% of world trade dependent on maritime transport, new questions will cover target setting and supplier engagement.

Sustainability CDP ESG

Practical Guide

V2G and Smart Charging: How Far Along?

Grid-scale storage grew 40% to 108 GW worldwide in 2025, and negative power prices are becoming routine in Europe. The direction toward EVs as distributed energy assets via smart charging and V2G is visible, but standardization (ISO 15118-20) and regulatory and warranty barriers keep adoption early-stage. We separate potential from deployed.

EV Market V2G Smart Charging

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US Connected-Vehicle Rule: SC Realignment

The US Commerce Department's (BIS) connected-vehicle final rule took effect on 17 March 2025. It bans China/Russia-linked supply — software from model year 2027 and hardware from 2030. Noting it is a phased entry, not a blanket ban, we map the supply-chain impact and the issues to check.

EV Market Connected Vehicles US Regulation

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China NEV: Price War Cools as Exports Surge

Per CAAM, China's 2025 NEV sales reached 16.49 million units, up 28.2% year-on-year, and NEV exports doubled to 2.62 million. Meanwhile, the number of discounted models fell from 147 to 106 as the price war cooled. Including BYD's rise and the EU's definitive countervailing duties, we map a China NEV market pivoting to export-led growth.

EV Market China NEV EV Exports

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India BRSR: Mandatory for Top 1,000 Companies

India's FY26 reporting season is under way for BRSR (Business Responsibility and Sustainability Report), the country's ESG disclosure framework. SEBI introduced the framework in its May 10, 2021 circular, requiring the top 1,000 listed companies by market capitalization to disclose against the NGRBC 9 principles. Listed companies, including banks, are filing reports.

Sustainability India BRSR

Practical Guide

Battery Costs and BEV Parity

IEA data shows China's battery prices fell about 30% in 2024. BEVs lead on price in China, while combustion cars remain cheaper in Germany and the US.

EV Market Battery costs BEV

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ASE 310mm PLP Line: Industry First for AI Chips

ASE developed the industry-first automated 310mm PLP line for AI/HPC chips, with 96,100mm² usable area and production starting 1H 2027.

Power Semiconductors ASE Panel-Level Packaging

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Entegris/Inpria: EUV MOR Resist Cross-License

Entegris and JSR subsidiary Inpria signed a non-exclusive cross-license covering metal oxide resist (MOR) patents for EUV lithography. The agreement covers formulation, precursor synthesis, and ultra-high-purity filtration, and also ends the pending IPR2025-00267 patent review.

Power Semiconductors Entegris JSR

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Global EV Sales 2026: A Bifurcating Market

Global electric car sales topped 17 million in 2024, up 25% year-on-year, with a new-car share above 20%. But the growth is uneven: China exceeded 11 million and emerging markets grew about 40%, while Europe flatlined. We read the bifurcation behind the impairments and target cuts using primary data.

EV Market EV Market Electric Vehicles

Practical Guide

EU Battery Regulation: PCF Reporting Practice

Organizes PCF reporting under Regulation (EU) 2023/1542 Article 7, the February 2027 obligation for the Battery Passport, and the connections between ISO 14067, PEFCR, and Scope 3 Category 11.

Sustainability EU Battery Regulation Carbon Footprint

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U.S. SEC: Full Rescission of Climate Disclosure Rule Proposed

The U.S. Securities and Exchange Commission (SEC) formally proposed on May 29, 2026 to rescind in full the climate disclosure rule adopted in March 2024. The rule covered GHG emissions, climate risk management, and financial effects of severe weather. The SEC says the rule exceeds its statutory authority; enforcement has been stayed since April 2024.

Sustainability SEC Climate Disclosure

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TDK: micro POL 'FS3303' Enters Mass Production

TDK began mass production of the ultra-compact 'FS3303' micro POL DC-DC module for AI edge devices on May 19, 2026. The 2.5x2.5mm, 1.2mm-high module delivers 3A, reaches about 95% peak efficiency, and supports 2.7-6V input and 0.4-3.3V output rails.

Power Semiconductors TDK micro POL

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California SB 253: Scope 1-3 Disclosure Mandated

California SB 253 requires companies with more than $1 billion in revenue and business activity in the state to disclose Scope 1-3 emissions annually. CARB formally approved the regulation in February 2026 and set the first-year Scope 1/2 reporting deadline for August 10, 2026. Out-of-state and non-U.S. companies may also be affected.

Sustainability California SB253

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Microchip: 3.3kV SiC Module HV-D3 Announced

Microchip announced the 3.3kV SiC power module 'HV-D3 mSiC' on May 26, 2026. With 6kV isolation, it can cut the number of series devices by about half versus lower-voltage SiC for 13.8kV and 34.5kV grid connections, covering 100-300A for AI data center solid-state transformers (SSTs).

Power Semiconductors Microchip SiC

Practical Guide

Scope 2: Market-based and Location-based Methods

Explains dual reporting, 8 quality criteria, PPA inclusion conditions, and confirmation of Japanese market-based emission factors required by the GHG Protocol Scope 2 Guidance 2015.

Sustainability Scope 2 GHG Protocol

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AIXTRON: FY2026 Guidance Raised on 30% Order Growth

AIXTRON released its Q1 2026 preliminary results, with order intake reaching approximately €171 million (+30% YoY), driven by surging data-center optical communications demand. The company raised its FY2026 full-year revenue guidance from approximately €520 million to approximately €560 million.

Power Semiconductors AIXTRON MOCVD

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WFE: Transition Equity Classification Principles Draft

The World Federation of Exchanges (WFE) released the 'Draft WFE Transition Equity Principles' on May 26, 2026. The framework defines how exchanges can classify companies that are not yet green but are on a transition pathway toward climate targets, aiming to channel capital flows into transition finance.

Sustainability WFE transition finance

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Toshiba: 1200V SiC MOSFET TW007D120E with Enhanced FOM

Toshiba Device & Storage commenced test sample shipments of its 1200V trench-gate SiC MOSFET 'TW007D120E' on May 20, 2026. The device achieves approximately 52% improvement in the figure of merit Rds(on)×Qgd compared to current products, with the company targeting adoption in AI data center power supplies and renewable energy equipment.

Power Semiconductors Toshiba SiC MOSFET

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Vietnam: Decree 180 on Forest Carbon Credits July 2026

Vietnam's government has promulgated Decree No. 180/2026/ND-CP, mandating a floor price, Ministry of Agriculture and Rural Development verification requirements, and double-counting prevention locks for forest carbon credit trading. With enforcement beginning July 2026, Southeast Asia's leading carbon market — backed by 14.87 million hectares of forest — establishes its regulatory foundation.

Sustainability Vietnam forest carbon

News

Mitsubishi: 1200V NX IGBT Sample Cuts Loss by 19%

Mitsubishi Electric has begun sample shipments of its 8th-generation NX-type 1200V IGBT modules in May 2026. The new modules reduce power loss by up to 19% compared to the previous generation, targeting adoption in industrial inverters, UPS systems, and solar power generation systems.

Power Semiconductors Mitsubishi Electric IGBT

News

TISFD: Beta 0.1 Release for Social Inequality Disclosure

The Taskforce on Inequality and Social-related Financial Disclosures (TISFD) released Beta Version 0.1 on May 26, 2026. The framework is designed to disclose human capital, human rights, and inequality across four dimensions — impacts, dependencies, risks, and opportunities — and is aligned with TCFD and TNFD.

Sustainability TISFD social disclosure

Practical Guide

China IGBT Market: Is 30% Cheaper Worth It on TCO?

Is Chinese IGBT's 30%-lower price real competitiveness or a temporary offensive? We weigh the full TCO — AEC-Q101 cost, redesign hours, and supply risk.

Power Semiconductors IGBT Chinese Semiconductors

News

Rohm: 750V SiC MOSFET SCT4013DLL Replaces IGBT in BBUs

ROHM's TOLL-package 750V SiC MOSFET 'SCT4013DLL', entering mass production in September 2025, is gaining traction in BBU (Battery Backup Unit) applications for AI servers. This article covers the adoption drivers and key specifications.

Power Semiconductors ROHM SiC MOSFET

News

New Zealand: Mandatory Climate Disclosure via NZ CS 1

An overview of the entities subject to the Aotearoa New Zealand Climate Standards developed by the XRB, and the three-scenario analysis requirements under NZ CS 1. Examines the framework's design characteristics in comparison with the EU CSRD and IFRS S2.

Sustainability XRB New Zealand

Practical Guide

Double Materiality Assessment: CSRD IRO Implementation

The first wave of CSRD started ESRS reporting in FY2024, while the second and third waves are subject to the April 2025 postponement. Considering the December 2025 Omnibus I, we break down IRO identification and IMA/FMA determination into practical procedures.

Sustainability CSRD Double Materiality Assessment

News

FSA: Independent Assurance and ISSA 5000 for SSBJ

On May 19, 2026, Japan's Financial Services Agency amended the SSBJ notice to align its effective date with the ISSA 5000 adoption date (March 13). On May 25, the newly established Assurance Subcommittee held its inaugural meeting, marking a concrete step toward formalizing independent assurance frameworks for sustainability disclosure in Japan.

Sustainability SSBJ ISSA5000

News

India: SEBI, NISM, IICA Sign MOU on ESG/BRSR Disclosure

India's NISM and IICA signed a May 19, 2026 MOU to build ESG/BRSR disclosure capacity and support MSME capital market access.

Sustainability SEBI BRSR

News

World Bank: Carbon Pricing Trends 2026 and Market Growth

The World Bank says 87 carbon pricing tools now cover 29% of global GHG emissions, with 2025 government revenue above $107 billion.

Sustainability carbon pricing World Bank

News

AI Data Centers: Recovery Signs in onsemi/Infineon Q1-Q2

Common trends from onsemi Q1 2026 and Infineon Q2 FY2026 earnings. As power demand for AI data centers expands rapidly, automotive applications remain in recovery. A breakdown of the two-axis structural shift that design and procurement teams should understand.

Data Center Power onsemi Infineon

Practical Guide

Scope 3: Guide to Primary Data Collection from Suppliers

Supply chain emissions are estimated to be 11.4 times greater on average than direct operational emissions. Drawing on the GHG Protocol Supplier Engagement Guidance and the Ministry of the Environment Guide (v1.0), this article organizes who to collect primary data from, what to collect, and how far down the supply chain to go. Covers tier structure, the top-concentration principle, and approaches for small and medium-sized suppliers.

Sustainability Scope 3 Supplier Engagement

Practical Guide

SiC Modules: Practical Thermal Design and TIM Selection

A practical overview of key thermal design considerations for SiC power modules. Covers TIM thermal resistance dominance, real-world liquid cooling flow rate examples, a comparison of top-side cooling and double-sided heat dissipation packages, and power cycle test standards — written for design and procurement engineers.

Power Semiconductors SiC Thermal Design

Feature

CBAM Guide: Scope and Certificates

CBAM entered full application in January 2026 for steel, aluminum, fertilizers, cement, hydrogen, and electricity. This guide covers authorized declarants, EU ETS-linked certificates, the 50t de minimis exemption, the first annual declaration deadline on September 30, 2027, certificate sales from February 2027, Omnibus simplification, late-2025 implementing rules, and third-country carbon price deductions.

Sustainability CBAM Carbon Border Adjustment Mechanism

Practical Guide

IGBT to SiC MOSFET: Evaluating TCO and Miniaturization

The key criterion for deciding to switch from IGBT to SiC is not a device-level cost comparison, but rather how SiC-enabled downsizing of cooling systems and passive components changes the overall system BOM cost and product specifications. This article organizes application-specific decision frameworks and hybrid SiC as an intermediate solution.

Power Semiconductors IGBT SiC

Feature

CSRD & CSDDD 2026: Scope, Supply-Chain Duties & Actions

CSRD and CSDDD 2026: revised scope after Omnibus I, cascading supply-chain duties, and practical steps to comply.

Sustainability CSRD CSDDD

News

ESRS 2.0: Public Consultation Opens on Simplified Draft

The European Commission opened consultation on ESRS 2.0, a simplified CSRD standards draft with implications for EU supply chain reporting.

Sustainability sustainability reporting regulation

News

Germany: €5B CCfD Scheme for Industrial Decarbonization

In spring 2026, the European Commission formally approved €5 billion in state aid for Germany's industrial decarbonization program 'Klimaschutzverträge (Climate Protection Contracts).' Targeting three sectors where European carbon costs weigh most heavily — steel, chemicals, and cement — the scheme's core mechanism addresses the barriers that prevent companies from committing to decarbonization investments.

Sustainability decarbonization CBAM

Practical Guide

GX-ETS: Emission Calculation and Reporting Guide 2026

Japan's GX Emissions Trading System (GX-ETS) launches as a mandatory scheme in April 2026, targeting GX League member companies with annual CO₂ emissions exceeding 100,000 tonnes (approximately 300–400 companies). This guide covers the end-to-end operational workflow for the first year of compliance, from inventorying emission sources and selecting calculation methods to third-party verification and integrated design with SSBJ disclosure.

Sustainability GX-ETS Emissions Trading

Practical Guide

Human Rights DD: 6 Practical Steps for Mid-Cap Makers

Organizes the human rights due diligence required by CSDDD and LkSG into 6 actionable steps for mid-sized manufacturers. Covers what to document at each step—from policy formulation and risk mapping to grievance mechanisms and disclosure—to pass EU business partner audits, explained from a practical operations perspective.

Sustainability Human Rights Due Diligence CSDDD

News

Infineon: FY2026 Q2 Growth Driven by AI, GaN, and SiC

Raising full-year guidance is a decision semiconductor manufacturers handle with care. In an industry repeatedly caught off guard by inventory corrections and demand misreads, an upward revision to the outlook ripples not just through share prices but across the entire supply chain. Here is the context behind Infineon Technologies making that call in its FY2026 Q2 earnings report.

Power Semiconductors Infineon GaN

Feature

Power Devices: Technology Outlook Beyond SiC and GaN

As SiC and GaN become mainstream for industrial and automotive power semiconductors, three next-generation candidates — Ga₂O₃ (gallium oxide), GaN-on-GaN (native substrate), and diamond semiconductors — are at the forefront of R&D. This article maps the technology maturity, mass-production timelines, and business impact of each material, and outlines the steps designers and procurement managers should take today.

Power Semiconductors GaN SiC

Practical Guide

SiC Suppliers: Alternative Sources to Reduce Wolfspeed Use

Wolfspeed's bankruptcy and restructuring has highlighted the risks of single-supplier dependency in SiC procurement. This guide compares Infineon CoolSiC, onsemi EliteSiC, ROHM, Mitsubishi Electric, Fuji Electric, and Chinese manufacturers on key characteristics and selection criteria, providing a framework for building a multi-supplier strategy.

Power Semiconductors SiC Wolfspeed

News

World Bank: Carbon Pricing Covers One-Third of Emissions

According to the World Bank, carbon pricing policies currently cover approximately one-third of global emissions. This is a significant indicator of the widespread adoption of carbon pricing as a climate change mitigation measure.

Sustainability carbon pricing emissions

Practical Guide

CBAM: Practical Data Flow and Declaration Steps for EU

While EU importers bear the direct obligation to file under the EU Carbon Border Adjustment Mechanism (CBAM), Japanese manufacturers are responsible for calculating and providing embedded emissions data. This article systematically organizes roles by stakeholder, declaration workflows, and submission data requirements from a practical standpoint—covering quarterly reporting during the transitional period through annual declarations and certificate surrender from 2026 onward.

Sustainability CBAM EU Regulations

News

CBAM: India Aluminum Exports Fall 41.7% on Carbon Costs

Following the full enforcement of the EU CBAM, India's unalloyed aluminum exports to the EU fell 41.7% in a single year. Drawing on the first quantitative data showing carbon costs materializing as real trade costs, we examine the structural risks now facing manufacturers.

Sustainability CBAM India

News

Doosan Acquires SK Siltron: SiC Wafer Supply Shift 2026

Doosan acquires 100% of SK Siltron for ~5 trillion KRW. We assess the SiC wafer vertical-integration play despite a 414bn KRW impairment and covenant risk.

Power Semiconductors SiC SiC wafer

News

SSBJ & CBAM: Dual 2026 Mandate for Disclosure/Carbon Cost

SSBJ disclosure and CBAM carbon costs both take effect in 2026. Shared supply chain emissions data will determine response efficiency.

Sustainability SSBJ ISSB

News

India Semis: Tata-ASML Partnership and First Fab Launch

In May 2026, Tata Electronics and ASML signed a memorandum of understanding, bringing India's first advanced semiconductor fab closer to reality. From the $11 billion Dholera fab to the participation of Japanese firms including ROHM, India's supply chain buildout is moving from 'vision' to 'execution.'

Power Semiconductors India semiconductor fab

News

Cyient Announces India's First GaN Power ICs

Cyient has unveiled 650V GaN power ICs targeting AI, telecommunications, fast charging, and e-mobility applications. These ICs deliver improved power efficiency and contribute to enhanced performance in next-generation applications.

Power Semiconductors GaN power IC

News

GaN Market: Navitas Earnings and India Mass Production

Navitas Semiconductor's Q1 2026 earnings beat expectations, driving a surge in its stock price, underscoring the market success of its GaN technology.

Power Semiconductors GaN Financial Results

News

Rohm: ¥158.4B SiC Impairment Loss and Industry Reform

ROHM recorded an impairment loss of ¥193.6 billion in its power semiconductor business for the fiscal year ending March 2025, resulting in a net loss of ¥158.4 billion, primarily due to impairments on fixed assets in the SiC business.

Power Semiconductors Power Semiconductors SiC

News

SSBJ: 3 Key Preparations for Suppliers by April 2027

Sosius has launched a free AI diagnostic tool, "SSBJ...", for companies listed on the Tokyo Stock Exchange Prime, in preparation for the Sustainability Standards Board of Japan (SSBJ) disclosure standards (applicable from the April 2027 period), enabling companies to easily assess their disclosure readiness.

Sustainability Sustainability Disclosure AI

Feature

BRSR Core Guide: ESG Disclosure and Procurement for India

BRSR Core's phased rollout expands to the top 1,000 listed companies in FY26-27. Procurement professionals need to understand what disclosures Indian listed mid-caps are required to make — and what they are actually preparing. This article outlines the framework structure and real-world corporate responses.

Sustainability BRSR India

News

CBAM: Carbon Cost Guide for Japan Steel and Chemical Firms

The EU Carbon Border Adjustment Mechanism (CBAM) entered full implementation in January 2026. With six sectors covered — steel, aluminum, fertilizers, cement, hydrogen, and electricity — Japanese exporters face requirements to calculate and declare embedded emissions. This article examines the current state of compliance and the key practical issues at stake.

Sustainability CBAM Europe

Practical Guide

CDP: ESG Disclosure Maturity in Japanese Mid-Cap Makers

CDP response history helps procurement teams assess Scope 1 and 2 data readiness and ESG disclosure maturity in Japan.

Sustainability CDP ESG Disclosure

Practical Guide

Circular Economy: EU Rules Reshape Resource Cycling

EU circular economy rules are changing product design, waste management, and recycled-material procurement for manufacturers with EU-bound products.

Sustainability Circular Economy EU Regulations

News

CSRD/CSDDD: EU Customer Compliance

CSRD and CSDDD can reach suppliers through EU customer questionnaires, contract clauses, and disclosure requests. This article maps priority actions.

Sustainability CSRD CSDDD

News

AI Data Center Power Devices 2026: SiC/GaN UPS & PSU Demand

Generative-AI data centers are driving SiC/GaN UPS and PSU adoption as efficiency rules tighten. 2026 power-device demand trends and what they mean.

Data Center Power Data Center Power Semiconductors

Practical Guide

EcoVadis: Improving Scores in 4 Procurement Domains

EcoVadis is an ESG scoring platform widely adopted by major Western companies for supplier evaluation. Assessment covers four domains — environment, labor and human rights, ethics, and sustainable procurement. This article explains what each score band means and outlines the practical steps to reach the Silver threshold (50 points).

Sustainability EcoVadis Procurement Evaluation

Practical Guide

ESG Data Management: Designing Collection and Disclosure

As ESG disclosure mandates advance, building infrastructure for data collection, aggregation, and reporting has become a pressing operational need. This article examines the limits of spreadsheet-based management, criteria for selecting dedicated tools, and how to design internal data flows — from the perspective of building a disclosure-ready system.

Sustainability ESG Data Disclosure Infrastructure

Practical Guide

European OEMs: SiC Procurement Shift

VW, BMW, and Stellantis are redesigning SiC procurement. This article maps integration, long-term contracts, diversified sourcing, and Tier 1 impacts.

Power Semiconductors SiC European OEM

Practical Guide

GaN-on-Si: The Next Decade of Industrial Power Electronics

GaN-on-Si is displacing silicon in low-to-mid voltage applications below 650V. Having gained an early foothold in EV on-board chargers, this technology is now extending its reach into industrial motor control, telecom power supplies, and industrial UPS. This article examines adoption trends by application and the key procurement considerations.

Power Semiconductors GaN Power Semiconductors

News

Green Hydrogen Cost Trends 2026: Production Cost per kg

Green hydrogen production cost per kg in 2026 still runs 3–4x grey hydrogen. How falling renewables and electrolyzer scale-up are closing the gap.

Sustainability Green Hydrogen Decarbonization

News

How GX-ETS Phase 2 Ripples Down to Mid-Tier Suppliers

GX-ETS Phase 2 affects more than 300-400 direct participants. This article maps how Scope 3 data requests reach mid-tier suppliers.

Sustainability GX-ETS Japan

Practical Guide

Human Rights Due Diligence: Practical Guide for Makers

Against the backdrop of Japan's National Action Plan on Business and Human Rights (2021–2025) and pressure from the EU's CSDDD, supply chain-wide human rights due diligence has become a practical challenge for Japanese manufacturers. This article outlines the basic structure — what to identify, how to respond, and what to disclose — and clarifies response priorities.

Sustainability Human Rights DD Supply Chain

Feature

China IGBT Market: Self-Sufficiency Reshapes Supply

Chinese IGBT makers — BYD, Starpower, CRRC Times — are raising self-sufficiency and going global, reshaping competition with EU and Japanese suppliers.

Power Semiconductors IGBT Chinese Semiconductors

Practical Guide

India Manufacturing: Green Shift via PLI and BRSR Schemes

India is strengthening manufacturing through PLI while advancing BRSR Core disclosure. This article frames supplier evaluation for global procurement.

Sustainability India PLI

News

Internal Carbon Pricing: Embedding Carbon Costs in Business

Internal Carbon Pricing embeds carbon costs into investment, supplier evaluation, and product design decisions before external rules arrive.

Sustainability Internal Carbon Price Carbon Pricing

Practical Guide

J-Credit: Practical CO2 Reduction Guide for Manufacturers

The J-Credit Scheme allows manufacturers to convert CO2 reductions from energy-efficient equipment installation, renewable energy use, and forest management into certified credits, which can then be applied to GX-ETS compliance or Scope 2 reduction. This article covers the most useful methodologies for manufacturers and key practical considerations in the application process.

Sustainability J-Credit Energy Efficiency

Practical Guide

Power Modules: Comparing Tier 1 Supplier Competitiveness

This article benchmarks six leading power module suppliers — Infineon, onsemi, STMicro, Mitsubishi Electric, Fuji Electric, and Rohm — across four dimensions: product lineup, SiC capability, supply capacity, and price competitiveness. The findings are intended as a reference for procurement source selection.

Power Semiconductors Power Modules Supplier Comparison

Feature

How to Calculate PCF: A Practical LCA Guide (ISO 14067)

How to calculate a Product Carbon Footprint (PCF): mapping ISO 14067 and the GHG Protocol Product Standard, setting boundaries, priorities, and pitfalls.

Sustainability PCF LCA

Practical Guide

Renewable Energy: Comparing J-Credit, NFC, and PPA

There are three primary options for reducing Scope 2 emissions: J-Credits, non-fossil certificates (FIT and non-FIT), and PPAs. Because they differ in cost, ease of implementation, and eligibility for initiatives like RE100, companies must choose the right mix for their specific situation. This article organizes the characteristics of each option and provides a selection framework.

Sustainability Renewable Energy Procurement J-Credit

Practical Guide

SBTi SME Program: Practical Application Guide and Changes

SBTi (Science Based Targets initiative) offers a simplified commitment pathway for small and medium-sized enterprises (SMEs). This article organizes the differences from the standard track, the preparation required for application, and practical examples from Japan. It serves as a practical reference for mid-size manufacturers that have begun to receive SBTi commitment requests from major customers.

Sustainability SBTi SME

Practical Guide

Scope 3: Category Measurement and Priorities for Makers

The GHG Protocol classifies Scope 3 into 15 categories. When manufacturers disclose their value chain emissions, the categories that should be prioritized depend on their industry and supply chain structure. This article organizes a prioritization approach based on emissions weight and measurement difficulty.

Sustainability Scope 3 GHG Protocol

News

SiC Market 2026: Demand Shift to Industrial as EV Slows

SiC demand is shifting from EV to industrial, solar, and data centers as EV growth slows. What the structural change means for supplier portfolios.

Power Semiconductors SiC EV

Practical Guide

SiC Modules: Next-Gen Packaging and Thermal Design Trends

Performance limitations in SiC power modules are often attributable to packaging rather than the devices themselves. The shift from gel encapsulation to epoxy and ceramic encapsulation, and the adoption of double-sided cooling structures, are packaging and assembly technology trends that will determine the competitiveness of next-generation SiC systems.

Power Semiconductors SiC Power Module

Practical Guide

Solar Inverter Power Devices: Si IGBT vs SiC vs GaN

How solar PCS choose between Si IGBT, SiC MOSFET, and GaN-on-Si by application and output scale — selection criteria and supplier positioning.

Power Semiconductors Solar Power Power Conditioning System

Feature

SSBJ Disclosure: Japan Mandate Prep Overview

SSBJ standards were finalized in March 2025; the February 2026 Cabinet Office Ordinance confirmed FY2027 mandatory rollout for Prime firms over JPY3tn.

Sustainability SSBJ ESG disclosure

Practical Guide

TCFD: Financial Impact and Physical Risk Quantification

TCFD framework-based climate risk disclosure requires estimating the financial impact of transition and physical risks on financial statements. This work — which is also essential for compliance with SSBJ and ISSB standards — involves organizing the conceptual approach and the specific impact pathways for manufacturers.

Sustainability TCFD Climate Risk

News

TNFD: Nature-Related Risk Disclosure for Manufacturers

TNFD (Taskforce on Nature-related Financial Disclosures) published its final recommendations in 2023, establishing a framework for disclosing nature-related risks in biodiversity, water, land, and ocean. This article organizes how this framework — often described as the natural counterpart to TCFD — applies to manufacturer supply chain assessment.

Sustainability TNFD Biodiversity

News

Wide Bandgap Cost Roadmap: 8-inch SiC & GaN-on-Si (2026)

8-inch SiC wafers and GaN-on-Si epitaxy are reshaping wide-bandgap cost curves. When the gap versus silicon narrows, and the key cost-down factors.

Power Semiconductors SiC GaN

Feature

AI Data Centers: High-Density Power Design for 100kW Racks

Power consumption for a single rack of servers running GPT-4 has surged from an average of 10-15kW in 2020 to over 100kW for racks equipped with the latest AI accelerators, with NVIDIA H100-dense racks approaching 70kW individually, and further increases anticipated with the next-generation Blackwell architecture.

Data Center Power AI server data center

Practical Guide

AI Server Power Supplies: GaN Adoption Criteria

Deciding whether to adopt GaN in AI server power supply design isn't solely based on it being "next-generation technology"; it requires confirming GaN's clear advantages over SiC and Si along the three axes of switching frequency, power density, and thermal design.

Power Semiconductors AI server GaN

News

BYD Expands 1200V SiC Output for In-House EV Inverters

BYD Semiconductor is scaling 1200V SiC MOSFET output for its own EV inverters — the world's largest EV maker moving upstream into power semiconductors.

Power Semiconductors BYD EV

Practical Guide

Chinese SiC Manufacturers: Selection Criteria

Many teams are internally divided on whether to adopt Chinese SiC manufacturers, with some voicing concerns about quality and others emphasizing the undeniable cost factor, but responding to this question with a simple "not adopting because it's Chinese" or "adopting because it's cheap" is too simplistic a judgment; what is being asked is how and what to verify.

Power Semiconductors China SiC

Feature

EV Power Semiconductor Application Selection Matrix

The cost of SiC power modules per inverter is 2 to 3 times higher than traditional Si-based modules, yet EV manufacturers are accelerating their transition to SiC because the increased efficiency and reduced size of the overall system offset this higher component cost; however, it is not simply a matter of "using SiC," as EV power conversion systems are divided into multiple applications, each with its own...

Power Semiconductors EV power module

Practical Guide

EV SiC Inverters: Loss Calculation and Range Improvement

A 1% increase in conversion efficiency for EV inverters translates to a difference of several kilometers in driving range; when design engineers face the challenge of improving real-world efficiency beyond catalog values, the first question they encounter is "which losses to calculate and how." Without correctly decomposing the loss breakdown, SiC may not yield the expected efficiency improvements.

Power Semiconductors EV SiC

Practical Guide

SiC vs. GaN for EV Applications: Choosing the Right Material

The adoption of 800V battery systems is accelerating, exemplified by the Porsche Taycan, Hyundai IONIQ 6, and Kia EV6, all of which have transitioned from traditional 400V architectures to double the voltage to shorten charging times and improve driving efficiency, a trend directly impacting power device selection, as evidenced by Si

Power Semiconductors EV GaN

News

Fuji Electric Unveils Next-Generation IGBT

As the mid-2020s saw increasing pronouncements of silicon IGBTs becoming obsolete, Fuji Electric unveiled its next-generation IGBTs. Positioned by the company as "8th generation," these devices reportedly achieve significant improvements over conventional models in both switching loss and on-voltage, poised to revolutionize EV inverters.

Power Semiconductors IGBT 富士電機

Practical Guide

GaN Power Semis: Miniaturization and Efficiency Benefits

If you've ever wrestled with improving power conversion efficiency by a single point in inverter design, the numbers alone tell you what GaN (Gallium Nitride) has changed: while silicon MOSFETs hit a wall at tens of kHz switching frequencies, GaN handles up to several MHz, enabling smaller passive components (inductors, capacitors).

Power Semiconductors GaN power semiconductor

Feature

Are IGBTs Still Relevant in the Age of SiC and GaN Silicon?

The long-heralded transition of power in the power conversion market is underway, with the SiC power device global market projected for rapid expansion towards the 2030s, and GaN adoption broadening from home appliances to data center power supplies. This raises the question about Silicon IGBTs...

Power Semiconductors IGBT SiC

Practical Guide

Industrial Inverters: SiC MOSFET Reliability Evaluation

When considering SiC MOSFET adoption in industrial inverter design, the focus often falls on loss and switching speed. However, a more understated and fundamental question that frequently becomes a practical concern in the field is the device's survivability during load short circuits, as the nature of applications differs between EVs and industrial equipment, where inverters are operational.

Power Semiconductors SiC industrial

News

Infineon CoolSiC Product Lineup Updates

Infineon's CoolSiC update should be read through voltage coverage, gate structure, short-circuit margin, and driver fit.

Power Semiconductors Infineon SiC

News

Infineon-SK Siltron SiC Wafer Deal Cuts Risk

Infineon signed a multi-year SiC wafer deal with SK Siltron in 2025, securing supply as the SiC wafer chain shifts to long-term contracts.

Power Semiconductors Infineon SK Siltron

News

Japanese Power Semiconductor Trio's Integration Progress

The "consolidation of three Japanese power semiconductor firms" concept, repeatedly reported since 2025, has garnered attention as a state-backed restructuring initiative supported by Japan's Ministry of Economy, Trade and Industry; however, tracking the movements of the involved companies reveals that the outline of the consolidation remains vague, prompting a need to clarify what has been decided and what remains undecided in the current situation.

Power Semiconductors Japan market restructuring

News

Mitsubishi Electric: 8-inch SiC Substrates with Coherent

Mitsubishi Electric and Coherent, a leading player in optical components and semiconductor materials, have agreed to jointly develop 8-inch (200mm) SiC wafers, marking a pivotal shift from the current 6-inch (150mm) standard that will fundamentally alter manufacturing cost structures by increasing chip yield per wafer.

Power Semiconductors 8-inch SiC Coherent

News

onsemi SiC Business Performance Outlook

As 2025 begins, a prevailing view is that onsemi's SiC business is not growing as much as market expectations, with its SiC business, primarily for EV inverters, facing headwinds from the slowing electrification pace in Europe and the US, leading to a series of downward revisions to full-year forecasts. However, the company remains unwavering in its SiC investment strategy, a stance of "standing firm" that...

Power Semiconductors SiC onsemi

Feature

Power Semiconductor Market Restructuring Map 2026

While the SiC power semiconductor market is projected to reach approximately $3 billion in 2025 and exceed $10 billion by 2030 according to multiple research firms, the current industry focus has shifted from "growth" to "realignment," with the question now being less about who will capture the market and more about who will survive.

Power Semiconductors GaN SiC

Feature

Foundations for Power Semiconductor Supplier Evaluation

A design team preparing for high-volume production of EV inverters faced an initial hurdle in selecting SiC MOSFET suppliers: "We don't know which datasheets to compare." Simply juxtaposing spec sheets proved insufficient as measurement conditions altered the meaning of figures, and reliability data was presented in inconsistent formats across different companies.

Power Semiconductors SiC production

News

Renesas Acquires Transphorm GaN Business

Renesas Electronics has agreed to acquire Transphorm, a pioneer in GaN-on-SiC vertical GaN structures, in a deal set to fundamentally transform its power semiconductor portfolio in 2025.

Power Semiconductors GaN M&A

News

Renesas: 10-Year SiC Wafer Supply Deal with Wolfspeed

Renesas and Wolfspeed's 10-year SiC wafer agreement shows how supply, wafer quality, and 8-inch migration are becoming strategic assets.

Power Semiconductors Renesas SiC

Practical Guide

Evaluating the Adoption of ROHM's 5th Generation SiC MOSFET

As the next generation of SiC MOSFETs emerges, many companies are asking, "We want to evaluate the 5th generation, but where do we start?" Considering Rohm's announced 4th generation features of low on-resistance (RonA) and high short-circuit withstand capability, evaluation of the 5th generation must go beyond device specifications alone, encompassing compatibility with protection circuits and thermal design considerations.

Power Semiconductors ROHM SiC

Feature

Power Semi Majors: Investment Strategies for SiC, GaN, IGBT

As multiple demand waves surge simultaneously—including the shift in EV inverter dominance, pressure for higher efficiency in industrial equipment, and soaring power density in data centers—major semiconductor manufacturers face critical choices regarding where to invest, defend, and divest among SiC, GaN, and IGBT technologies.

Power Semiconductors GaN IGBT

Practical Guide

SiC 8-inch Wafer Supply System

While SiC power semiconductor wafer sizes are transitioning from 6-inch (150mm) to 8-inch (200mm), a significant gap remains between the commencement of this transition and the establishment of a stable supply chain; when assessing the 8-inch wafer supply chain from a design and procurement perspective, the pace of transition is a critical factor.

Power Semiconductors 8-inch SiC SiC

Feature

SiC and GaN Business Opportunities: Evaluation Criteria

SiC or GaN: The next-generation power semiconductor question, while frequently asked in the industry, is somewhat simplistic; though both are wide bandgap semiconductors, SiC and GaN differ in their optimal voltage ranges, switching domains, and cost structures, meaning the answer depends on the application, voltage range, and timeframe under consideration, rather than a simple 'which is superior' approach.

Power Semiconductors GaN SiC

Practical Guide

Key Considerations for Selecting SiC Gate Drivers

As SiC MOSFET adoption accelerates, gate driver selection increasingly dictates design quality; the key lies in SiC devices' smaller die size and higher current density, leading to significantly faster temperature rises during short circuits compared to silicon (Si) devices, necessitating a different approach to protection circuit design.

Power Semiconductors SiC gate driver

Practical Guide

SiC Modules vs. Discrete Components: Selection Criteria

Once the decision to use SiC is made in the early stages of inverter design, the next question is whether to opt for modules or discrete components, a choice that, while appearing to be merely an implementation form, fundamentally impacts system performance, board area, protection circuit design, and procurement flexibility.

Power Semiconductors SiC power module

Practical Guide

SiC Wafer Price Trends and 2026 Outlook

The SiC power semiconductor market in 2024 saw slower-than-expected demand growth, prompting some manufacturers to revise production plans. This "plateau" situation directly impacts a wide range of decisions, from cost calculations for device design to the reassessment of procurement strategies, raising questions about wafer price movements. To discuss the outlook for 2026, we must first consider

Power Semiconductors SiC SiC wafer

Practical Guide

Navigating SiC Wafer Procurement Risks

As the adoption of SiC (Silicon Carbide) power semiconductors accelerates, securing a stable supply of wafers is increasingly becoming the biggest bottleneck after design completion, as even the most advanced devices selected during the design phase cannot be mass-produced without available wafers; therefore, to manage supply chain risks, it is crucial to structurally understand "how and where bottlenecks occur in each process.

Power Semiconductors SiC SiC wafer

News

STMicroelectronics Ampere SiC Power Modules for EV 2026

STMicroelectronics and Ampere are targeting 2026 commercialization of SiC power modules for next-generation EV traction inverters.

Power Semiconductors Ampere EV

News

STMicroelectronics SiC New Fab: Mass Production Progress

STMicroelectronics aims to capture EV and industrial demand by incrementally expanding its SiC power semiconductor fab in Catania, Italy, a move that, considering the scale and timing of investment and the pressure to monetize its SiC business, signals more than just a capacity increase.

Power Semiconductors EV STMicroelectronics

News

Toshiba: Triple-Gate IGBT Reduces Power Loss by 40%

Toshiba announces new "Triple-Gate IGBT" structure, capable of up to 40% loss reduction compared to conventional devices; this 40% improvement signifies more than a generational spec upgrade, as in industrial equipment, railways, and large inverters, the primary battlegrounds for IGBTs, even a 1% loss reduction directly impacts system cooling costs and annual electricity expenses.

Power Semiconductors IGBT Toshiba

Practical Guide

Wolfspeed: Changing SiC Procurement Risks Post-Restructure

Wolfspeed emerged from Chapter 11 in September 2025. While the risk of financial insolvency has been resolved, the Mohawk Valley Fab continues to run at utilization rates in the low 20s, shifting the fundamental risk from 'bankruptcy concern' to 'utilization-rate dependency.' Drawing on the strategic equity relationship with Renesas and Q3 FY2026 results, this article reexamines the evaluation criteria for SiC procurement.

Power Semiconductors SiC Wolfspeed