Power Semiconductors
SiC / GaN / IGBT vendor dynamics, supply chain, and procurement risk
DG Matrix Doubles SST Output to 400 kW
On September 24, 2026, DG Matrix said ST SiC devices doubled its Interport multi-port solid-state transformer from 200 kW to 400 kW in essentially the same power module footprint, at above 98.5% efficiency.
AQG 324 Automotive Qualification Guide
AQG 324 test requirements for humidity, power cycling, thermal shock and vibration, plus SiC MOSFET qualification hurdles and OEM demands.
TDK: micro POL 'FS3303' Enters Mass Production
TDK began volume production of the FS3303 micro POL module on May 19, 2026: 2.5x2.5mm, 1.2mm high, 3A output and about 95% peak efficiency.
Microchip: 3.3kV SiC Module HV-D3 Announced
Microchip's 3.3kV HV-D3 mSiC module with 6kV isolation halves series devices for 13.8kV and 34.5kV grid ties, covering 100-300A for data-center SSTs.
SiC Modules: Practical Thermal Design and TIM Selection
SiC power module thermal design: why TIM resistance dominates, liquid-cooling flow-rate examples, top-side vs double-sided packages, and power-cycle tests.
Power Modules: Comparing Tier 1 Supplier Competitiveness
Six power-module suppliers compared, Infineon, onsemi, STMicro, Mitsubishi Electric, Fuji Electric and ROHM, on lineup, SiC capability, capacity and price.
SiC Modules: Next-Gen Packaging and Thermal Design Trends
SiC module performance is limited by packaging: gel to epoxy and ceramic encapsulation, and the double-sided cooling structures that decide the next generation.
EV Power Semiconductor Application Selection Matrix
SiC modules cost 2-3x silicon per inverter, yet EV makers keep switching. Which EV power conversion applications justify SiC, and which do not.
SiC Modules vs. Discrete Components: Selection Criteria
SiC module or discrete is not just a packaging choice: it decides system performance, board area, protection design and procurement flexibility.
STMicroelectronics Ampere SiC Power Modules for EV 2026
STMicroelectronics and Ampere are targeting 2026 commercialization of SiC power modules for next-generation EV traction inverters.