Power Semiconductors
SiC / GaN / IGBT vendor dynamics, supply chain, and procurement risk
AQG 324 Automotive Power Module Qualification Practical Guide
Summarizes the test requirements for humidity, power cycling, thermal shock, and vibration defined by ZVEI/ECPE's AQG 324, specific qualification challenges for SiC MOSFETs, and how to address additional OEM requirements.
TDK: micro POL 'FS3303' Enters Mass Production
TDK began mass production of the ultra-compact 'FS3303' micro POL DC-DC module for AI edge devices on May 19, 2026. The 2.5x2.5mm, 1.2mm-high module delivers 3A, reaches about 95% peak efficiency, and supports 2.7-6V input and 0.4-3.3V output rails.
Microchip: 3.3kV SiC Module HV-D3 Announced
Microchip announced the 3.3kV SiC power module 'HV-D3 mSiC' on May 26, 2026. With 6kV isolation, it can cut the number of series devices by about half versus lower-voltage SiC for 13.8kV and 34.5kV grid connections, covering 100-300A for AI data center solid-state transformers (SSTs).
SiC Modules: Practical Thermal Design and TIM Selection
A practical overview of key thermal design considerations for SiC power modules. Covers TIM thermal resistance dominance, real-world liquid cooling flow rate examples, a comparison of top-side cooling and double-sided heat dissipation packages, and power cycle test standards — written for design and procurement engineers.
Power Modules: Comparing Tier 1 Supplier Competitiveness
This article benchmarks six leading power module suppliers — Infineon, onsemi, STMicro, Mitsubishi Electric, Fuji Electric, and Rohm — across four dimensions: product lineup, SiC capability, supply capacity, and price competitiveness. The findings are intended as a reference for procurement source selection.
SiC Modules: Next-Gen Packaging and Thermal Design Trends
Performance limitations in SiC power modules are often attributable to packaging rather than the devices themselves. The shift from gel encapsulation to epoxy and ceramic encapsulation, and the adoption of double-sided cooling structures, are packaging and assembly technology trends that will determine the competitiveness of next-generation SiC systems.
EV Power Semiconductor Application Selection Matrix
The cost of SiC power modules per inverter is 2 to 3 times higher than traditional Si-based modules, yet EV manufacturers are accelerating their transition to SiC because the increased efficiency and reduced size of the overall system offset this higher component cost; however, it is not simply a matter of "using SiC," as EV power conversion systems are divided into multiple applications, each with its own...
SiC Modules vs. Discrete Components: Selection Criteria
Once the decision to use SiC is made in the early stages of inverter design, the next question is whether to opt for modules or discrete components, a choice that, while appearing to be merely an implementation form, fundamentally impacts system performance, board area, protection circuit design, and procurement flexibility.
STMicroelectronics Ampere SiC Power Modules for EV 2026
STMicroelectronics and Ampere are targeting 2026 commercialization of SiC power modules for next-generation EV traction inverters.