TDK began mass production of "FS3303," an ultra-compact micro POL (point-of-load) DC-DC module for AI edge devices, on May 19, 2026. The module measures 2.5x2.5mm with a height of 1.2mm, delivers 3A, and reaches peak efficiency of about 95%.
Key Specifications
FS3303 supports input from 2.7V to 6V and output from 0.4V to 3.3V, addressing low-voltage rails for ASICs, SoCs, and AI chipsets. TDK integrates the controller, driver, MOSFET, and inductor in its 3D chip-embedded package, reducing external components and board area.
Portfolio Expansion
FS3303 is the first step in TDK's micro POL expansion. The company says its POL converter lineup is planned to cover 3A to 80A and output voltages from 0.3V to 3.3V. Placing power conversion close to the load is becoming a standard approach for efficiently supplying low-voltage, high-current rails to ASICs.
Background: Faster Optical Modules
As optical module speeds scale from 10Gbit/s to 1.6Tbit/s, demand is rising sharply for ultra-compact power supplies that can deliver power within limited board area. In optical modules and AI edge systems where layout constraints are severe, shrinking the power module becomes a core design requirement.
Implications for Design and Procurement
In designs that supply low-voltage, high-current rails close to an ASIC, power module size and efficiency determine performance and thermal behavior. A 2.5mm-square-class module with 95% efficiency can increase implementation density in optical modules and AI edge devices. With mass production underway, the next practical step is to confirm supply readiness and sample availability, then fold it into board-level power design.