目录
01 射频设计公司以投资方式进入功率半导体 02 ThinSiC以“重复使用衬底”降低成本 03 对采购与设计负责人的意义 04 参考事实卡片 2026年10月29日，印度CG Power and Industrial Solutions的全资子公司Axiro Semiconductor宣布对美国硅谷碳化硅（SiC ）功率器件开发企业ThinSiC进行战略投资。Axiro在ThinSiC最新一轮融资中担任领投方，并签订了支持其技术开发与商业化的长期商业合作协议。CG Power于同日将该新闻稿披露至孟买证券交易所（BSE）和印度国家证券交易所（NSE）。投资金额和融资总额均未公布。
射频设计公司以投资方式进入功率半导体 Axiro总部位于班加罗尔，核心业务是射频、毫米波和高速互连的芯片设计。该公司在官网介绍，十多年来累计出货4亿颗器件，产品覆盖10kHz至40GHz。目前尚无功率半导体产品。该公司表示，此次投资是将产品组合拓展至电力电子的战略的一部分。它没有自行建设碳化硅制造能力，而是通过投资拥有技术的初创企业并与之合作来进入该领域。
見るポイント 01
投资形式 在ThinSiC最新一轮融资中担任领投方，并签订长期商业合作协议。投资金额未披露。
02
目标用途 铁路牵引装置、工业驱动、输配电基础设施。未提及电动车。
03
销售渠道 借助母公司CG Power在印度输配电和工业基础设施领域的业务基础，拓展印度国内外市场。
04
ThinSiC的技术 通过横向外延生长减少缺陷，剥离薄外延层，使碳化硅衬底最多可重复使用10次（公司说法）。
Axiro首席执行官Naveen Yanduru表示，碳化硅将成为下一代电力电子的核心，而阻碍其普及的最大障碍是成本。他说，ThinSiC的技术正是针对长期制约高压碳化硅的成本和量产性难题。
ThinSiC以“重复使用衬底”降低成本 ThinSiC总部位于美国加利福尼亚州圣克拉拉。据其官网介绍，该公司利用横向外延过生长（ELO）减少晶体缺陷，并将形成的超薄外延层从衬底上分离。由此碳化硅衬底最多可重复使用10次，从而降低材料成本和设备投资。该公司称，从衬底到外延层的缺陷减少了80%以上，并列出两项美国专利（第12,125,697号和第11,848,197号）。
该公司认为，现有碳化硅器件价格是硅器件的3至5倍，晶圆制造占成本的大部分，并提出了实现与硅相当的成本以及可用于电网电力转换的高压器件等目标。以上均为该公司自己的说法，尚未公布第三方验证结果，也未公布量产时间、耐压、电流额定值等产品规格。
对采购与设计负责人的意义 参考事实卡片
CG Power subsidiary Axiro Semiconductor becomes lead investor in US-based ThinSiC's latest funding round
On October 29, 2026, Axiro Semiconductor (Bengaluru, India) announced a strategic investment in ThinSiC of Silicon Valley. Axiro participated as lead investor in ThinSiC's latest funding round and also signed a long-term commercial partnership to support the development and commercialization of ThinSiC's SiC power device technology. The announcement does not state the investment amount or the total size of the round.
CG Power files Axiro's press release with the Bombay Stock Exchange and the National Stock Exchange of India
On October 29, 2026, CG Power and Industrial Solutions (BSE code 500093, NSE symbol CGPOWER) filed with the BSE and NSE the press release issued by its wholly owned subsidiary Axiro Semiconductor on the investment in ThinSiC. Axiro is a wholly owned subsidiary of CG Power, part of the Murugappa Group, and is headquartered in Bengaluru.
Axiro expands from RF and mmWave into power semiconductors, naming rail traction, industrial drives and grid infrastructure as SiC applications
Axiro positioned the investment as part of a strategy to extend its portfolio, centered on RF, millimeter-wave and high-speed connectivity, into power electronics. It named rail traction, industrial drives and grid infrastructure as applications where SiC is becoming an alternative to silicon. Because CG Power is deeply embedded in India's grid and industrial infrastructure, Axiro says it can serve as a commercial channel to bring ThinSiC's technology to customers in India and abroad.
Axiro CEO: "Cost is the biggest barrier to SiC adoption" — says ThinSiC's technology addresses the cost and scalability challenges of high-voltage SiC
In the announcement, Axiro CEO Naveen Yanduru said SiC will be central to next-generation power electronics and that cost has been the biggest barrier to its adoption. He said ThinSiC's technology directly addresses the cost and scalability challenges that have held back high-voltage SiC. ThinSiC founder and CEO T.S. Ravi said Axiro's semiconductor expertise and its access to one of India's leading industrial groups would accelerate the commercialization of ThinSiC's SiC devices.
ThinSiC develops technology that reduces defects with lateral epitaxial growth and lifts off thin epitaxial layers so substrates can be reused up to 10 times
According to ThinSiC, it reduces crystal defects through epitaxial lateral overgrowth (ELO), improving yield and reliability. Because the ultrathin epitaxial layers it forms can be separated from the substrate, each SiC substrate can be reused up to 10 times, significantly lowering material costs. Optical microscope images show defects reduced by more than 80% from substrate to epitaxial layer. Its patents are US Patent Nos. 12,125,697 and 11,848,197. The company says thin devices reduce switching losses and improve heat dissipation within the package.
ThinSiC targets silicon-level cost and high-voltage devices for the power grid
On its website, ThinSiC notes that existing SiC devices cost 3–5 times as much as silicon devices, with wafer manufacturing accounting for most of the cost and requiring heavy capital spending. In response, the company lists its targets as cost parity with silicon, higher current through low defect density, higher voltage ratings usable for power conversion on the grid, and lower capital spending through substrate reuse. It is headquartered in Santa Clara, California. Founder T.S. Ravi previously founded Crystal Solar.
Axiro has shipped 400 million RF devices over more than a decade, with products from 10kHz to 40GHz
On its website, Axiro says it has shipped 400 million devices over more than a decade and offers wideband and narrowband products from 10kHz to 40GHz. Its products include RF and mmWave amplifiers, mixers, RF switches and beamformers for phased arrays, targeting wireless infrastructure, satellite communications, and aerospace and defense.
