Power Semiconductors
SiC / GaN / IGBT vendor dynamics, supply chain, and procurement risk
Infineon FY2026 Q2 Earnings — AI Data Center Power Semiconductors Drive Growth, Full-Year Guidance Raised
Raising full-year guidance is a decision semiconductor manufacturers handle with care. In an industry repeatedly caught off guard by inventory corrections and demand misreads, an upward revision to the outlook ripples not just through share prices but across the entire supply chain. Here is the context behind Infineon Technologies making that call in its FY2026 Q2 earnings report.
SiC Wafer Geopolitics: What Doosan's Acquisition of SK Siltron Signals
South Korea's Doosan announces a full 100% stake acquisition of SK Siltron in a deal valued at approximately 5 trillion KRW. We examine the vertical integration strategy moving forward despite a 414 billion KRW impairment in the SiC business and 1.2 trillion KRW in covenant issues, and place it in the context of Japan-Korea supply chain cooperation.
India's Semiconductors Shift into High Gear: The Tata-ASML Partnership Signals a Move from Vision to Execution
In May 2026, Tata Electronics and ASML signed a memorandum of understanding, bringing India's first advanced semiconductor fab closer to reality. From the $11 billion Dholera fab to the participation of Japanese firms including ROHM, India's supply chain buildout is moving from 'vision' to 'execution.'
Data Center Power Demand and Power Device Trends — Key Issues for 2026
Power consumption at data centers is surging on the back of generative AI investment. As efficiency requirements tighten, SiC- and GaN-based UPS and PSU designs are becoming mainstream. This article examines the evolving demand for power devices in power infrastructure and the implications for procurement.
The IGBT Market Shifts — How Chinese Manufacturers Are Changing the Procurement Landscape
Chinese IGBT manufacturers such as BYD Semiconductor, Starpower Semiconductor, and CRRC Times are rapidly increasing domestic self-sufficiency and accelerating their entry into global markets. Intensifying price competition and concerns about oversupply are reshaping the competitive landscape against European and Japanese suppliers. This article examines the procurement implications.
Comparing the Competitiveness of Power Module Tier 1 Suppliers
This article benchmarks six leading power module suppliers — Infineon, onsemi, STMicro, Mitsubishi Electric, Fuji Electric, and Rohm — across four dimensions: product lineup, SiC capability, supply capacity, and price competitiveness. The findings are intended as a reference for procurement source selection.
AI Server Power Supplies: GaN Adoption Criteria
Deciding whether to adopt GaN in AI server power supply design isn't solely based on it being "next-generation technology"; it requires confirming GaN's clear advantages over SiC and Si along the three axes of switching frequency, power density, and thermal design.
Infineon and SK Siltron Sign SiC Wafer Supply Agreement
In 2025, Infineon signed a multi-year SiC wafer supply agreement with SK Siltron, symbolizing a structural shift in the SiC supply chain where wafer procurement secured through single long-term contracts will determine the competitiveness of power semiconductors.
Renesas and Wolfspeed Sign 10-Year SiC Wafer Supply Agreement
Renesas Electronics and Wolfspeed have signed a 10-year long-term supply agreement for SiC wafers, a duration that highlights the significance of this unprecedented pact in the semiconductor industry, moving beyond a buyer's market for SiC wafer procurement.
SiC 8-inch Wafer Supply System
While SiC power semiconductor wafer sizes are transitioning from 6-inch (150mm) to 8-inch (200mm), a significant gap remains between the commencement of this transition and the establishment of a stable supply chain; when assessing the 8-inch wafer supply chain from a design and procurement perspective, the pace of transition is a critical factor.
Navigating SiC Wafer Procurement Risks
As the adoption of SiC (Silicon Carbide) power semiconductors accelerates, securing a stable supply of wafers is increasingly becoming the biggest bottleneck after design completion, as even the most advanced devices selected during the design phase cannot be mass-produced without available wafers; therefore, to manage supply chain risks, it is crucial to structurally understand "how and where bottlenecks occur in each process.