On October 15, 2026, Infineon and Wolfspeed announced a new multi-year supply agreement for 200 mm SiC wafers. The two companies have a supply relationship of more than 20 years. Infineon says that moving its existing Wolfspeed supply from 150 mm to 200 mm substrates directly supports its own conversion to 200 mm SiC manufacturing.
Neither announcement discloses the contract value, supply volume or term.
The two announcements describe "150 mm" differently
The agreement is the same, but the two companies explain it differently.
Infineon's description
A new multi-year supply agreement. Existing supply from Wolfspeed \
Wolfspeed's description
An \
Common ground
200 mm SiC wafer supply is added. The deal builds on a relationship of more than 20 years.
Not disclosed
Contract value, volume, term, and when 150 mm supply ends.
Read Infineon's way, 150 mm winds down step by step; read Wolfspeed's way, 150 mm and 200 mm run in parallel for now. Either way, both companies agree that the center of Infineon's substrate supply is moving to 200 mm.
Wolfspeed said the agreement strengthens its position as a leading Western manufacturer in the SiC market. On October 7 it had just received a conditional commitment for up to $1.5 billion of financing from the U.S. Department of War, and a 200 mm agreement with a major customer followed.
Why Infineon is moving to 200 mm
The core of Infineon's 200 mm SiC volume production is its fab in Kulim, Malaysia. The company says it designed the fab to become the world's largest and most competitive SiC manufacturing site. Infineon sources substrates from multiple suppliers, and Wolfspeed is one of them.
On demand, Infineon said AI data centers are emerging as a major demand driver for SiC power semiconductors. Power conversion efficiency across the data center is a direct operating cost for hyperscalers, and SiC suits specific conversion stages where silicon reaches its practical limits. Together with EV drivetrains, solar inverters and industrial motor drives, Infineon said the long-term outlook for 200 mm substrates is strong.
Wolfspeed's announcement cites Yole's "Power SiC 2026 – Markets and Applications" report, which expects the global SiC power device market to more than triple from $3.4 billion in 2024 to $11.1 billion in 2031 (a third-party research figure).
What it means for procurement and design teams
- Check the life of 150 mm parts: when major device makers move their substrate supply to 200 mm, products from 150 mm lines become likely candidates for a generation change. If you use SiC devices built on 150 mm substrates, confirm with the maker how long supply will continue
- Don't judge supply risk from one contract: Infineon sources substrates from several companies. Rather than judging the stability of Infineon SiC supply from the Wolfspeed deal alone, also look at the 200 mm and 300 mm progress of each substrate maker
- Wolfspeed's customer base: after its 10-year agreement with Renesas, Wolfspeed has now won a 200 mm agreement with Infineon. The conditions for funding its loan include offtake agreements, so long-term contracts with large customers also bear on how its finances are assessed