Power Semiconductors
SiC / GaN / IGBT vendor dynamics, supply chain, and procurement risk
Next-Generation Power Device Technology Outlook — Design and Procurement Strategies Beyond SiC and GaN
As SiC and GaN become mainstream for industrial and automotive power semiconductors, three next-generation candidates — Ga₂O₃ (gallium oxide), GaN-on-GaN (native substrate), and diamond semiconductors — are at the forefront of R&D. This article maps the technology maturity, mass-production timelines, and business impact of each material, and outlines the steps designers and procurement managers should take today.
SiC Alternative Supplier Comparison — A Practical Guide to Reducing Wolfspeed Dependency
Wolfspeed's bankruptcy and restructuring has highlighted the risks of single-supplier dependency in SiC procurement. This guide compares Infineon CoolSiC, onsemi EliteSiC, ROHM, Mitsubishi Electric, Fuji Electric, and Chinese manufacturers on key characteristics and selection criteria, providing a framework for building a multi-supplier strategy.
Data Center Power Demand and Power Device Trends — Key Issues for 2026
Power consumption at data centers is surging on the back of generative AI investment. As efficiency requirements tighten, SiC- and GaN-based UPS and PSU designs are becoming mainstream. This article examines the evolving demand for power devices in power infrastructure and the implications for procurement.
European OEM SiC Procurement Strategies — Reading the Impact on Japanese Tier 1 Suppliers
Major European OEMs including VW, BMW, and Stellantis are redesigning their SiC procurement strategies. Amid a mix of three approaches — vertical integration, long-term contracts, and diversified sourcing — this article examines the implications for Japanese Tier 1 suppliers and the directions they should consider.
GaN-on-Si and the Next Decade of Industrial Power Electronics
GaN-on-Si is displacing silicon in low-to-mid voltage applications below 650V. Having gained an early foothold in EV on-board chargers, this technology is now extending its reach into industrial motor control, telecom power supplies, and industrial UPS. This article examines adoption trends by application and the key procurement considerations.
The IGBT Market Shifts — How Chinese Manufacturers Are Changing the Procurement Landscape
Chinese IGBT manufacturers such as BYD Semiconductor, Starpower Semiconductor, and CRRC Times are rapidly increasing domestic self-sufficiency and accelerating their entry into global markets. Intensifying price competition and concerns about oversupply are reshaping the competitive landscape against European and Japanese suppliers. This article examines the procurement implications.
Comparing the Competitiveness of Power Module Tier 1 Suppliers
This article benchmarks six leading power module suppliers — Infineon, onsemi, STMicro, Mitsubishi Electric, Fuji Electric, and Rohm — across four dimensions: product lineup, SiC capability, supply capacity, and price competitiveness. The findings are intended as a reference for procurement source selection.
Power Device Selection Logic for Solar Inverters
Solar power conditioning systems (PCS) use Si IGBT, SiC MOSFET, and GaN-on-Si selectively depending on application type and output scale. We examine the decision criteria for device selection, the positioning of major suppliers, and key procurement considerations.
Infineon and SK Siltron Sign SiC Wafer Supply Agreement
In 2025, Infineon signed a multi-year SiC wafer supply agreement with SK Siltron, symbolizing a structural shift in the SiC supply chain where wafer procurement secured through single long-term contracts will determine the competitiveness of power semiconductors.
Renesas and Wolfspeed Sign 10-Year SiC Wafer Supply Agreement
Renesas Electronics and Wolfspeed have signed a 10-year long-term supply agreement for SiC wafers, a duration that highlights the significance of this unprecedented pact in the semiconductor industry, moving beyond a buyer's market for SiC wafer procurement.
SiC 8-inch Wafer Supply System
While SiC power semiconductor wafer sizes are transitioning from 6-inch (150mm) to 8-inch (200mm), a significant gap remains between the commencement of this transition and the establishment of a stable supply chain; when assessing the 8-inch wafer supply chain from a design and procurement perspective, the pace of transition is a critical factor.
SiC Modules vs. Discrete Components: Selection Criteria
Once the decision to use SiC is made in the early stages of inverter design, the next question is whether to opt for modules or discrete components, a choice that, while appearing to be merely an implementation form, fundamentally impacts system performance, board area, protection circuit design, and procurement flexibility.
SiC Wafer Price Trends and 2026 Outlook
The SiC power semiconductor market in 2024 saw slower-than-expected demand growth, prompting some manufacturers to revise production plans. This "plateau" situation directly impacts a wide range of decisions, from cost calculations for device design to the reassessment of procurement strategies, raising questions about wafer price movements. To discuss the outlook for 2026, we must first consider
Navigating SiC Wafer Procurement Risks
As the adoption of SiC (Silicon Carbide) power semiconductors accelerates, securing a stable supply of wafers is increasingly becoming the biggest bottleneck after design completion, as even the most advanced devices selected during the design phase cannot be mass-produced without available wafers; therefore, to manage supply chain risks, it is crucial to structurally understand "how and where bottlenecks occur in each process.
Wolfspeed: Managing Risks and Alternative Sourcing Strategies
Wolfspeed's financial struggles have long been a topic of industry discussion, but a significant gap remains between recognizing "management risk" and deciding "how to address it next." This article aims to bridge that gap by outlining the structure of the risks and exploring practical alternative sourcing options.