Power Semiconductors
SiC / GaN / IGBT vendor dynamics, supply chain, and procurement risk
Practical Guide to Power Semiconductors for Grid Stabilization: STATCOM, HVDC, FACTS
A comprehensive overview of power semiconductors for STATCOM and HVDC systems, which are seeing increased demand due to renewable energy integration. Covers Mitsubishi Electric's ±450MVAr track record, Infineon's 4500V IGBT modules, LCC vs. VSC technology selection, and procurement insights.
China IGBT Market: Is 30% Cheaper Worth It on TCO?
Is Chinese IGBT's 30%-lower price real competitiveness or a temporary offensive? We weigh the full TCO — AEC-Q101 cost, redesign hours, and supply risk.
SiC Modules: Practical Thermal Design and TIM Selection
A practical overview of key thermal design considerations for SiC power modules. Covers TIM thermal resistance dominance, real-world liquid cooling flow rate examples, a comparison of top-side cooling and double-sided heat dissipation packages, and power cycle test standards — written for design and procurement engineers.
IGBT to SiC MOSFET: Evaluating TCO and Miniaturization
The key criterion for deciding to switch from IGBT to SiC is not a device-level cost comparison, but rather how SiC-enabled downsizing of cooling systems and passive components changes the overall system BOM cost and product specifications. This article organizes application-specific decision frameworks and hybrid SiC as an intermediate solution.
Power Devices: Technology Outlook Beyond SiC and GaN
As SiC and GaN become mainstream for industrial and automotive power semiconductors, three next-generation candidates — Ga₂O₃ (gallium oxide), GaN-on-GaN (native substrate), and diamond semiconductors — are at the forefront of R&D. This article maps the technology maturity, mass-production timelines, and business impact of each material, and outlines the steps designers and procurement managers should take today.
SiC Suppliers: Alternative Sources to Reduce Wolfspeed Use
Wolfspeed's bankruptcy and restructuring has highlighted the risks of single-supplier dependency in SiC procurement. This guide compares Infineon CoolSiC, onsemi EliteSiC, ROHM, Mitsubishi Electric, Fuji Electric, and Chinese manufacturers on key characteristics and selection criteria, providing a framework for building a multi-supplier strategy.
European OEMs: SiC Procurement Shift
VW, BMW, and Stellantis are redesigning SiC procurement. This article maps integration, long-term contracts, diversified sourcing, and Tier 1 impacts.
GaN-on-Si: The Next Decade of Industrial Power Electronics
GaN-on-Si is displacing silicon in low-to-mid voltage applications below 650V. Having gained an early foothold in EV on-board chargers, this technology is now extending its reach into industrial motor control, telecom power supplies, and industrial UPS. This article examines adoption trends by application and the key procurement considerations.
China IGBT Market: Self-Sufficiency Reshapes Supply
Chinese IGBT makers — BYD, Starpower, CRRC Times — are raising self-sufficiency and going global, reshaping competition with EU and Japanese suppliers.
Power Modules: Comparing Tier 1 Supplier Competitiveness
This article benchmarks six leading power module suppliers — Infineon, onsemi, STMicro, Mitsubishi Electric, Fuji Electric, and Rohm — across four dimensions: product lineup, SiC capability, supply capacity, and price competitiveness. The findings are intended as a reference for procurement source selection.
Infineon and SK Siltron Sign SiC Wafer Supply Agreement
In 2025, Infineon signed a multi-year SiC wafer supply agreement with SK Siltron, symbolizing a structural shift in the SiC supply chain where wafer procurement secured through single long-term contracts will determine the competitiveness of power semiconductors.
SiC 8-inch Wafer Supply System
While SiC power semiconductor wafer sizes are transitioning from 6-inch (150mm) to 8-inch (200mm), a significant gap remains between the commencement of this transition and the establishment of a stable supply chain; when assessing the 8-inch wafer supply chain from a design and procurement perspective, the pace of transition is a critical factor.
SiC Modules vs. Discrete Components: Selection Criteria
Once the decision to use SiC is made in the early stages of inverter design, the next question is whether to opt for modules or discrete components, a choice that, while appearing to be merely an implementation form, fundamentally impacts system performance, board area, protection circuit design, and procurement flexibility.
SiC Wafer Price Trends and 2026 Outlook
The SiC power semiconductor market in 2024 saw slower-than-expected demand growth, prompting some manufacturers to revise production plans. This "plateau" situation directly impacts a wide range of decisions, from cost calculations for device design to the reassessment of procurement strategies, raising questions about wafer price movements. To discuss the outlook for 2026, we must first consider
Navigating SiC Wafer Procurement Risks
As the adoption of SiC (Silicon Carbide) power semiconductors accelerates, securing a stable supply of wafers is increasingly becoming the biggest bottleneck after design completion, as even the most advanced devices selected during the design phase cannot be mass-produced without available wafers; therefore, to manage supply chain risks, it is crucial to structurally understand "how and where bottlenecks occur in each process.
Wolfspeed: Changing SiC Procurement Risks Post-Restructure
Wolfspeed emerged from Chapter 11 in September 2025. While the risk of financial insolvency has been resolved, the Mohawk Valley Fab continues to run at utilization rates in the low 20s, shifting the fundamental risk from 'bankruptcy concern' to 'utilization-rate dependency.' Drawing on the strategic equity relationship with Renesas and Q3 FY2026 results, this article reexamines the evaluation criteria for SiC procurement.