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29 results — category: longtail Clear filter

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GX-ETS Emissions Calculation and Reporting in Practice — A Preparation Guide for the First Year of Mandatory Compliance (FY2026)

Japan's GX Emissions Trading System (GX-ETS) launches as a mandatory scheme in April 2026, targeting GX League member companies with annual CO₂ emissions exceeding 100,000 tonnes (approximately 300–400 companies). This guide covers the end-to-end operational workflow for the first year of compliance, from inventorying emission sources and selecting calculation methods to third-party verification and integrated design with SSBJ disclosure.

SustainabilityGX-ETSEmissions Trading

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Human Rights Due Diligence Practical Workflow — 6 Steps Mid-Sized Manufacturers Should Take First

Organizes the human rights due diligence required by CSDDD and LkSG into 6 actionable steps for mid-sized manufacturers. Covers what to document at each step—from policy formulation and risk mapping to grievance mechanisms and disclosure—to pass EU business partner audits, explained from a practical operations perspective.

SustainabilityHuman Rights Due DiligenceCSDDD

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SiC Alternative Supplier Comparison — A Practical Guide to Reducing Wolfspeed Dependency

Wolfspeed's bankruptcy and restructuring has highlighted the risks of single-supplier dependency in SiC procurement. This guide compares Infineon CoolSiC, onsemi EliteSiC, ROHM, Mitsubishi Electric, Fuji Electric, and Chinese manufacturers on key characteristics and selection criteria, providing a framework for building a multi-supplier strategy.

Power SemiconductorsSiCWolfspeed

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CBAM Declaration Practical Flow: Steps and Submission Data Japanese Exporters Must Prepare

While EU importers bear the direct obligation to file under the EU Carbon Border Adjustment Mechanism (CBAM), Japanese manufacturers are responsible for calculating and providing embedded emissions data. This article systematically organizes roles by stakeholder, declaration workflows, and submission data requirements from a practical standpoint—covering quarterly reporting during the transitional period through annual declarations and certificate surrender from 2026 onward.

SustainabilityCBAMEU Regulations

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Reading ESG Disclosure Maturity in Japanese Mid-Cap Manufacturers Through CDP Response Records

CDP response history can be used as a proxy indicator in procurement evaluation to gauge companies' Scope 1 and 2 data collection infrastructure and ESG disclosure maturity. This article examines the actual state of CDP responses in Japan and how to interpret the disclosure readiness of non-responding companies.

SustainabilityCDPESG Disclosure

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Circular Economy and Manufacturing: How EU Regulations Are Reshaping Waste, Resource Cycling, and Design Philosophy

The EU's Circular Economy Action Plan (CEAP), Battery Regulation, and Ecodesign Regulation are changing requirements for product design, waste management, and recycled material procurement. This article outlines the regulatory structures pressing Japanese manufacturers to adapt and the procurement and development changes that come with transitioning to circular design.

SustainabilityCircular EconomyEU Regulations

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Improving Your EcoVadis Score in Practice: Addressing the Four Domains Evaluated in Procurement

EcoVadis is an ESG scoring platform widely adopted by major Western companies for supplier evaluation. Assessment covers four domains — environment, labor and human rights, ethics, and sustainable procurement. This article explains what each score band means and outlines the practical steps to reach the Silver threshold (50 points).

SustainabilityEcoVadisProcurement Evaluation

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ESG Data Management in Practice: How to Design Infrastructure for Collection, Aggregation, and Disclosure

As ESG disclosure mandates advance, building infrastructure for data collection, aggregation, and reporting has become a pressing operational need. This article examines the limits of spreadsheet-based management, criteria for selecting dedicated tools, and how to design internal data flows — from the perspective of building a disclosure-ready system.

SustainabilityESG DataDisclosure Infrastructure

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European OEM SiC Procurement Strategies — Reading the Impact on Japanese Tier 1 Suppliers

Major European OEMs including VW, BMW, and Stellantis are redesigning their SiC procurement strategies. Amid a mix of three approaches — vertical integration, long-term contracts, and diversified sourcing — this article examines the implications for Japanese Tier 1 suppliers and the directions they should consider.

Power SemiconductorsSiCEuropean OEM

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India's Green Manufacturing Transition: The Dual Shift Created by PLI Schemes and BRSR

India is strengthening its manufacturing sector through Production Linked Incentive (PLI) schemes while advancing ESG disclosure through the phased mandatory rollout of BRSR Core. The dynamic in which PLI-benefiting manufacturers simultaneously face BRSR compliance pressure creates a dual shift in how Japanese companies evaluate Indian suppliers.

SustainabilityIndiaPLI

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Making Full Use of J-Credit for Manufacturers: A Comparison of Credit Types and Application Practicalities

The J-Credit Scheme allows manufacturers to convert CO2 reductions from energy-efficient equipment installation, renewable energy use, and forest management into certified credits, which can then be applied to GX-ETS compliance or Scope 2 reduction. This article covers the most useful methodologies for manufacturers and key practical considerations in the application process.

SustainabilityJ-CreditEnergy Efficiency

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Comparing the Competitiveness of Power Module Tier 1 Suppliers

This article benchmarks six leading power module suppliers — Infineon, onsemi, STMicro, Mitsubishi Electric, Fuji Electric, and Rohm — across four dimensions: product lineup, SiC capability, supply capacity, and price competitiveness. The findings are intended as a reference for procurement source selection.

Power SemiconductorsPower ModulesSupplier Comparison

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Comparing Three Renewable Energy Procurement Options: J-Credit, Non-Fossil Certificates, and PPA

There are three primary options for reducing Scope 2 emissions: J-Credits, non-fossil certificates (FIT and non-FIT), and PPAs. Because they differ in cost, ease of implementation, and eligibility for initiatives like RE100, companies must choose the right mix for their specific situation. This article organizes the characteristics of each option and provides a selection framework.

SustainabilityRenewable Energy ProcurementJ-Credit

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SBTi SME Program in Practice: Differences from the Standard Track and How to Apply

SBTi (Science Based Targets initiative) offers a simplified commitment pathway for small and medium-sized enterprises (SMEs). This article organizes the differences from the standard track, the preparation required for application, and practical examples from Japan. It serves as a practical reference for mid-size manufacturers that have begun to receive SBTi commitment requests from major customers.

SustainabilitySBTiSME

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SiC Module Packaging Technology Trends — How Next-Generation Packages Are Redefining Thermal Design

Performance limitations in SiC power modules are often attributable to packaging rather than the devices themselves. The shift from gel encapsulation to epoxy and ceramic encapsulation, and the adoption of double-sided cooling structures, are packaging and assembly technology trends that will determine the competitiveness of next-generation SiC systems.

Power SemiconductorsSiCPower Module

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Power Device Selection Logic for Solar Inverters

Solar power conditioning systems (PCS) use Si IGBT, SiC MOSFET, and GaN-on-Si selectively depending on application type and output scale. We examine the decision criteria for device selection, the positioning of major suppliers, and key procurement considerations.

Power SemiconductorsSolar PowerPower Conditioning System

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AI Server Power Supplies: GaN Adoption Criteria

Deciding whether to adopt GaN in AI server power supply design isn't solely based on it being "next-generation technology"; it requires confirming GaN's clear advantages over SiC and Si along the three axes of switching frequency, power density, and thermal design.

Power SemiconductorsAI serverGaN

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Chinese SiC Manufacturers: Selection Criteria

Many teams are internally divided on whether to adopt Chinese SiC manufacturers, with some voicing concerns about quality and others emphasizing the undeniable cost factor, but responding to this question with a simple "not adopting because it's Chinese" or "adopting because it's cheap" is too simplistic a judgment; what is being asked is how and what to verify.

Power SemiconductorsChinaSiC

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SiC Inverter for EVs: Loss Calculation and Efficiency Improvement

A 1% increase in conversion efficiency for EV inverters translates to a difference of several kilometers in driving range; when design engineers face the challenge of improving real-world efficiency beyond catalog values, the first question they encounter is "which losses to calculate and how." Without correctly decomposing the loss breakdown, SiC may not yield the expected efficiency improvements.

Power SemiconductorsEVSiC

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SiC vs. GaN for EV Applications: Choosing the Right Material

The adoption of 800V battery systems is accelerating, exemplified by the Porsche Taycan, Hyundai IONIQ 6, and Kia EV6, all of which have transitioned from traditional 400V architectures to double the voltage to shorten charging times and improve driving efficiency, a trend directly impacting power device selection, as evidenced by Si

Power SemiconductorsEVGaN

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GaN Power Semiconductors: Benefits of Efficiency and Miniaturization

If you've ever wrestled with improving power conversion efficiency by a single point in inverter design, the numbers alone tell you what GaN (Gallium Nitride) has changed: while silicon MOSFETs hit a wall at tens of kHz switching frequencies, GaN handles up to several MHz, enabling smaller passive components (inductors, capacitors).

Power SemiconductorsGaNpower semiconductor

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Key Points in SiC Reliability Evaluation for Industrial Inverters

When considering SiC MOSFET adoption in industrial inverter design, the focus often falls on loss and switching speed. However, a more understated and fundamental question that frequently becomes a practical concern in the field is the device's survivability during load short circuits, as the nature of applications differs between EVs and industrial equipment, where inverters are operational.

Power SemiconductorsSiCindustrial

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Evaluating the Adoption of ROHM's 5th Generation SiC MOSFET

As the next generation of SiC MOSFETs emerges, many companies are asking, "We want to evaluate the 5th generation, but where do we start?" Considering Rohm's announced 4th generation features of low on-resistance (RonA) and high short-circuit withstand capability, evaluation of the 5th generation must go beyond device specifications alone, encompassing compatibility with protection circuits and thermal design considerations.

Power SemiconductorsROHMSiC

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SiC 8-inch Wafer Supply System

While SiC power semiconductor wafer sizes are transitioning from 6-inch (150mm) to 8-inch (200mm), a significant gap remains between the commencement of this transition and the establishment of a stable supply chain; when assessing the 8-inch wafer supply chain from a design and procurement perspective, the pace of transition is a critical factor.

Power Semiconductors8-inch SiCSiC

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Key Considerations for Selecting SiC Gate Drivers

As SiC MOSFET adoption accelerates, gate driver selection increasingly dictates design quality; the key lies in SiC devices' smaller die size and higher current density, leading to significantly faster temperature rises during short circuits compared to silicon (Si) devices, necessitating a different approach to protection circuit design.

Power SemiconductorsSiCgate driver

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SiC Modules vs. Discrete Components: Selection Criteria

Once the decision to use SiC is made in the early stages of inverter design, the next question is whether to opt for modules or discrete components, a choice that, while appearing to be merely an implementation form, fundamentally impacts system performance, board area, protection circuit design, and procurement flexibility.

Power SemiconductorsSiCpower module

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SiC Wafer Price Trends and 2026 Outlook

The SiC power semiconductor market in 2024 saw slower-than-expected demand growth, prompting some manufacturers to revise production plans. This "plateau" situation directly impacts a wide range of decisions, from cost calculations for device design to the reassessment of procurement strategies, raising questions about wafer price movements. To discuss the outlook for 2026, we must first consider

Power SemiconductorsSiCSiC wafer

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Navigating SiC Wafer Procurement Risks

As the adoption of SiC (Silicon Carbide) power semiconductors accelerates, securing a stable supply of wafers is increasingly becoming the biggest bottleneck after design completion, as even the most advanced devices selected during the design phase cannot be mass-produced without available wafers; therefore, to manage supply chain risks, it is crucial to structurally understand "how and where bottlenecks occur in each process.

Power SemiconductorsSiCSiC wafer

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Wolfspeed: Managing Risks and Alternative Sourcing Strategies

Wolfspeed's financial struggles have long been a topic of industry discussion, but a significant gap remains between recognizing "management risk" and deciding "how to address it next." This article aims to bridge that gap by outlining the structure of the risks and exploring practical alternative sourcing options.

Power SemiconductorsSiCSiC wafer