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News

PJM's Grid Rules for AI Data-Center Large Loads

PJM, one of the largest US grid operators, is building rules to reliably connect large loads such as AI data centers. It announced an integration plan in January 2026 and, on February 27, filed at FERC to extend the capacity-auction price collar and expedite interconnection. It offers bring-your-own-generation and an expedited track. We map this new phase of grid constraints with primary sources.

Data Center Powerdatacenter-powerPJM

News

Samsung SDI Takes Full Control of the GM Battery JV

Samsung SDI acquired GM's 49.99% stake in the SynergyCells JV, its first wholly owned plant in North America. Slower-than-expected EV demand was the direct reason; the New Carlisle, Indiana plant ($3.5B, 27–36 GWh) pivots to ESS. Samsung SDI and GM continue joint development of next-gen prismatic cells. We map the battery-supply reshuffle with primary sources.

EV Marketev-marketbattery

News

Li Auto Starts First Overseas Production in Kazakhstan

Li Auto signed an MOU with the Allur Group on July 16, 2026 for local assembly of its L-series in Kostanay, Kazakhstan. On July 20, it unveiled the new Li L9 in Almaty, marking its first market launch outside China.

EV MarketLi AutoKazakhstan

News

GM, SAIC Extend China JV to 2047

Per China's State Council Information Office, GM and SAIC Motor extended their China joint venture through 2047. SAIC GM plans over 30 NEV models by 2030, and Buick Electra E7 begins its first overseas exports in October 2026. SAIC Motor has produced 100 million vehicles cumulatively.

EV MarketGMSAIC

News

Power Integrations Hits Industry-First 2200V GaN

Power Integrations announced on August 5, 2026 the industry's first 2200V-rated PowiGaN technology. Target applications span AI data center 1500V distribution, EV auxiliary power, and solar inverters — moving GaN into voltage territory long dominated by SiC.

Power SemiconductorsGaNPowiGaN

News

Nextpower Completes Zigor Power Deal

Nextpower completed its acquisition of Zigor's power conversion business and Apex Power's assets on July 30, 2026. It plans to ramp US manufacturing across multiple sites, starting deliveries in early 2027 and targeting over 10GW online within 12 months.

Power SemiconductorsNextpowerZigor

News

SSBJ Handbook Revised on Partial Compliance

Japan's Sustainability Standards Board (SSBJ) revised its handbook on disclosure when not fully complying with SSBJ standards to Ver. 2.0 on July 31, 2026, prompted by a May advisory. The handbook is not the SSBJ standard itself and carries no legal force.

SustainabilitySSBJdisclosure

News

India-EU FTA Sets Up CBAM Annexure

The India-EU FTA concluded in January 2026, covering a combined $24 trillion market with 99.5% of India's exports gaining preferential access. Reports say it also includes a dedicated CBAM annexure covering EU-approved verification bodies and SME capacity building.

SustainabilityCBAMIndia

News

Global EV Sales Rebound 35% in Q2

Per an official IEA report, global EV sales rose 35% quarter-on-quarter and 4% year-on-year in Q2 2026, with growth in over 90 countries in H1. US sales fell 25% y-o-y as a tax credit ended, while over 1 million exported Chinese EVs remain unaccounted for as sales.

EV MarketIEAEV sales

News

RIR Power's India-First SiC Vertical Push

RIR Power Electronics, founded in 1969, rebranded in September 2025 as India's first vertically integrated SiC semiconductor maker. It is building a SiC power campus in Odisha with INR 6.18 billion in investment, listed on the NSE in July 2026, and targets FY2027 mass production.

Power SemiconductorsRIR Power ElectronicsSiC

News

DOE transmission study: data centers redraw the grid map

DOE has published a draft 2026 National Transmission Needs Study that identifies data centers, manufacturing expansion, and large industrial loads as key causes of transmission constraints. U.S. data-center electricity use is projected to rise from 176TWh, or 4.4% of total power, in 2023 to 325–580TWh and as much as 12% by 2028. This article maps a grid bottleneck that is becoming as material as semiconductors.

Data Center PowerDOEtransmission

News

Navitas and Magnachip: 3300V SiC licensing

On July 23, 2026, Navitas announced it will license GeneSiC Gen4/Gen5 technology, covering 1200V, 2300V, and above 3300V, to Magnachip. Magnachip will transfer and localize the technology at its Korean fab. The target is high-voltage grid infrastructure, industrial electrification, and energy storage rather than EVs, showing SiC competition broadening from automotive into power and industrial markets.

Power SemiconductorsNavitasMagnachip

News

STMicroelectronics Q2 2026: double-digit SiC growth and DC upside

STMicroelectronics reported Q2 2026 revenue of USD 3.49 billion, up 26% year on year, with a 34.8% gross margin. It expects double-digit SiC revenue growth in 2026, supported by the move from 6-inch to 8-inch wafers, and raised its AI data-center targets to over USD 1 billion in 2026 and over USD 2 billion in 2027. Q3 guidance is USD 3.70 billion and Q4 is expected to exceed USD 4 billion.

Power SemiconductorsSTMicroelectronicsSiC

News

EFRAG: SME ESRS consultation

In July 2026, EFRAG opened a public consultation on sustainability-disclosure standards for SMEs. The pillars are VSME, a voluntary standard for companies outside CSRD, and LSME for listed SMEs, effective from January 2026 with a two-year relief period. The standards aim to reduce the burden on mid-sized and small suppliers receiving Scope 3 demands from larger companies through a common format.

SustainabilityEFRAGESRS

News

GaN patent war: Infineon ITC win and Wolfspeed suit

Infineon secured a final U.S. ITC import and sales ban against Innoscience GaN products, the first large case in which European IP excludes Asian products from the U.S. market. Wolfspeed also sued Navitas for patent infringement, turning GaN patent battles into procurement risk.

Power SemiconductorsGaNpower semiconductors

News

The Geopolitics of Advanced Packaging: US CHIPS and the EU

Advanced packaging becomes a focus of national strategy. The US Commerce Department finalized $1.4 billion for advanced packaging via the CHIPS NAPMP, and Amkor invests ~$2 billion in Arizona (up to $400M in subsidies). The EU targets a 20% global share by 2030 under the European Chips Act and proposed a Chips Act 2.0 in June 2026. We map the US–EU policy race with primary sources.

Advanced Packagingadvanced packaginggeopolitics

News

SiC solid-state transformers: AIDC deployment begins

SiC solid-state transformers (SSTs) have entered the commercial stage. Weiguang Energy has shipped more than 100 SSTs and secured over 40GW of capacity across two sites. Delta has announced an SST delivering MW-class power in 1m² with more than 50% space savings, while Eaton offers its 2.5MW MV SST 2.0. This article reviews the move to direct conversion from medium voltage to 800VDC using primary information.

Power SemiconductorsSiCsolid-state transformer

News

AI compute now hinges on power: from FLOPS to MW

AI supercomputing is shifting from performance in FLOPS to power and efficiency. TOP500 leader LineShine reached 2.198 EF at 42.2 MW with a CPU-only design, while Microsoft Fairwater points to distributed AI superfactories. Primary data shows the move from FLOPS to megawatts.

Data Center Powerdata centerAI

News

SiC investment: EU approves EUR 659M, China raises capital

On July 14, 2026, the European Commission approved EUR 659 million in state aid for four semiconductor facilities in Germany. Element 3-5 receives EUR 353 million for SiC epitaxial wafers and Vishay EUR 214 million for a power-MOSFET plant. In China, AccoPower (芯聚能) and Xinyueneng (芯粤能) reportedly raised more than RMB 700 million in a Series D round. Public and private capital is accelerating into SiC supply chains in Europe and China.

Power SemiconductorsSiCEU Chips Act

News

CATL: deploy 5GWh of sodium-ion storage in Europe

CATL and Dutch company Alfen signed an MOU to deploy 5GWh of Tener Sodium, a sodium-ion BESS, in Europe. It supports more than 30MWh, 1% self-consumption, and RTE about 2% higher than LFP. China will tax lithium-ion batteries at 2% while exempting sodium-ion and solid-state batteries through the end of 2028. This article examines commercialization and policy moving together.

EV Marketsodium-ionCATL

News

The Hybrid Bonding Equipment Race

Chiplet density is decided by bonding technology. Applied Materials developed the industry's first integrated die bonder with Besi and took a 9% stake to deepen ties. SÜSS MicroTec is launching the world's first platform integrating W2W/D2W in one cluster. We map the US–Europe-led frontier of copper direct bonding (hybrid bonding) with primary sources.

Advanced Packagingadvanced packaginghybrid bonding

News

India Semiconductor: CG Semi Starts OSAT Production

CG Semi began commercial production at its G1 OSAT facility in Sanand, Gujarat, on July 4, 2026. The site can produce up to 300 million units per year, with more than ₹76 billion planned for G1 and G2 over five years.

Power Semiconductorspower semiconductorsIndia

News

New York: pause on new DCs above 50MW

On July 14, 2026, New York issued the first U.S. pause on state environmental permits for new hyperscale data centers above 50MW, for up to one year. About 12GW of data-center load is queued at NYISO. The previous day, Meta announced an expansion of Hyperion to 5GW and more than USD 50 billion. This article examines a U.S. market where regulation and expansion now proceed at once.

Data Center Powerdata centerregulation

News

Power semis: Infineon expands, onsemi sells fabs

Infineon opened one of the world's largest power semiconductor fabs in Dresden on July 2, 2026, with EUR 5 billion of investment and about 1,000 jobs, while onsemi is selling two fabs under Fab Right. Primary sources show how expansion and asset-light restructuring are diverging.

Power Semiconductorspower semiconductorsInfineon

News

ABF Substrates: AT&S and IBIDEN Ramp Up

ABF/IC substrates, tight with AI demand, enter a major ramp. AT&S agreed with AMD and others, repurposing its Kulim plant and doubling capex from €0.4B to €1.0–1.2B, while lifting its revenue outlook to 45–55%. IBIDEN commits ~¥500 billion over three years. We map the substrate supply that underpins advanced packaging with primary sources.

Advanced Packagingadvanced packagingABF substrate

News

China-made EVs and Europe

China-made EVs are gaining global presence. IEA says they accounted for 15% and more than 900,000 EVs sold in advanced economies in 2025, and could exceed one in four by 2035. Europe also reached a 20% BEV share in January 2026.

EV MarketEVChina

News

CoWoS/2.5D Packaging: TSMC vs Intel

TSMC's CoWoS (2.5D) underpins AI accelerator performance and is expanding to automotive qualification, System-on-Wafer in 2027, and COUPE (CPO) in 2026. Intel is consolidating Foveros volume production, EMIB, and ASAT at Fab 9. We map the shift of the main battleground to back-end packaging with primary sources.

Advanced Packagingadvanced packagingCoWoS

News

The Rise of Glass Substrates: Intel and SKC

Organic substrates approach their scaling limit by the end of the decade. The next move is glass. After a decade of research, Intel heads toward the 2030s, raising interconnect density and multi-chiplet integration with ultra-low flatness. SKC (Absolics) completed the world's first volume facility in Georgia, USA — 40% faster, with a $75M subsidy. We map the next-gen substrate for AI back-end.

Advanced Packagingadvanced packagingglass substrate

News

HBM4: Supply Chain and JEDEC Standard

SK hynix completed HBM4 development in September 2025, doubling bandwidth, improving power efficiency by 40%, and adopting 2,048 I/O. The JEDEC standard JESD270-4 defines 2 TB/s and 32 channels. Micron ramps 2.8 TB/s, 36GB 12H in 2026 and samples 48GB 16H. We map the supply chain and standard for HBM4, the star of AI memory.

Advanced Packagingadvanced packagingHBM

News

SiC/GaN 2026: China OEM demand

After the impairment cycle, SiC/GaN is shifting on both demand and technology. onsemi is supplying EliteSiC for NIO's 900V move and Geely's SEP system, partnering with Innoscience on GaN, while Toshiba and ROHM add new driver and cooling packages.

Power Semiconductorspower semiconductorsSiC

News

EU adopts revised ESRS

The European Commission adopted revised ESRS in July 2026, cutting mandatory data points by more than 60% and expected reporting costs per company by over 30%. It also introduced a voluntary standard for SMEs outside the CSRD scope, reflecting EFRAG technical advice and stakeholder input.

SustainabilityESRSCSRD

News

BYD June 2026: Exports Hit 40% of Sales

BYD's June 2026 NEV sales rose 5.5% to 403,472 units, with exports at 175,349 - over 40% of sales - as H1 domestic sales fell 15.7%.

EV MarketBYDNEV

News

FERC Starts DC Large-Load Reform

FERC issued a large-load interconnection ANOPR in October 2025 and plans action by June 2026 after reviewing more than 3,500 pages of comments. PJM summer peak demand is projected to rise 70GW over 15 years.

Data Center Powergrid interconnectiondata center

News

Na-ion Cell Proven Li-ion-Class

Cell Reports Physical Science analyzed mass-produced Hina sodium-ion cells in June 2026. Across 120 cells, impedance variation was 5.3%, discharge energy exceeded 80% at -20C, and commercial 18650 cells reached 110Wh/kg.

EV Marketsodium-ionbattery

News

SBTi: Corporate Net-Zero Standard V2.0 Released

On June 11, 2026, the Science Based Targets initiative (SBTi) released the revised Corporate Net-Zero Standard V2.0. It abandons a one-size-fits-all approach for multiple target-setting options and an implementation hierarchy, imposes phased responsibility for ongoing emissions on large companies, and strengthens implementation transparency.

SustainabilitySBTiNet Zero

News

CBAM Strengthening: EU Council Agrees on Downstream Expansion

On June 12, 2026, the Council of the EU agreed to extend the Carbon Border Adjustment Mechanism (CBAM) to certain downstream products and to strengthen anti-circumvention measures. Following the December 2025 Commission proposal, Parliament's plenary adoption is expected in September 2026, with final legislation likely in late 2026 to 2027.

SustainabilityCBAMEU

News

onsemi: full-range GaN push

onsemi's GaNEXUS pairs 650V GaN with GlobalFoundries and 40-200V GaN with Innoscience, with H1 2026 samples for AI data-center power.

Data Center PowerGaNonsemi

News

Wolfspeed: Gen 5 SiC Cuts Specific On-Resistance up to 27%

On June 9, 2026, Wolfspeed announced its fifth-generation SiC technology, reducing specific on-resistance (RSP) by up to 27% versus competing 1200V solutions. Covering 1200V/750V on a production-ready 200mm platform, it targets automotive traction inverters, industrial power supplies, and EV charging infrastructure.

Power SemiconductorsWolfspeedSiC MOSFET

News

NBIM Urges One Report for ESRS and ISSB

NBIM, the manager of Norway's $2 trillion sovereign wealth fund, has asked the EU to allow companies to meet ESRS and ISSB, including IFRS S1/S2, in one report. ISSB has been adopted in 42 jurisdictions covering about 60% of global GDP.

SustainabilityISSBESRS

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India Semiconductor: OSAT and Design Onshore

Tata is building India's first semiconductor assembly and test facility, TSAT, in Jagiroad, Assam, with an investment of Rs 27,000 crore, or more than $3 billion. After ramp-up, it is expected to produce up to 48 million chips per day and support more than 27,000 jobs.

Power SemiconductorsIndia SemiconductorOSAT

News

CDP Adds Ocean to Environmental Disclosure

Starting the week of June 15, 2026, CDP will add ocean as its sixth disclosure theme after climate, forests, water, biodiversity, and plastics. With about 90% of world trade dependent on maritime transport, new questions will cover target setting and supplier engagement.

SustainabilityCDPESG

News

US Connected-Vehicle Rule: SC Realignment

The US Commerce Department's (BIS) connected-vehicle final rule took effect on 17 March 2025. It bans China/Russia-linked supply — software from model year 2027 and hardware from 2030. Noting it is a phased entry, not a blanket ban, we map the supply-chain impact and the issues to check.

EV MarketConnected VehiclesUS Regulation

News

China NEV: Price War Cools as Exports Surge

Per CAAM, China's 2025 NEV sales reached 16.49 million units, up 28.2% year-on-year, and NEV exports doubled to 2.62 million. Meanwhile, the number of discounted models fell from 147 to 106 as the price war cooled. Including BYD's rise and the EU's definitive countervailing duties, we map a China NEV market pivoting to export-led growth.

EV MarketChina NEVEV Exports

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India BRSR: Mandatory for Top 1,000 Companies

India's FY26 reporting season is under way for BRSR (Business Responsibility and Sustainability Report), the country's ESG disclosure framework. SEBI introduced the framework in its May 10, 2021 circular, requiring the top 1,000 listed companies by market capitalization to disclose against the NGRBC 9 principles. Listed companies, including banks, are filing reports.

SustainabilityIndiaBRSR

News

ASE 310mm PLP Line: Industry First for AI Chips

ASE developed the industry-first automated 310mm PLP line for AI/HPC chips, with 96,100mm² usable area and production starting 1H 2027.

Power SemiconductorsASEPanel-Level Packaging

News

Entegris/Inpria: EUV MOR Resist Cross-License

Entegris and JSR subsidiary Inpria signed a non-exclusive cross-license covering metal oxide resist (MOR) patents for EUV lithography. The agreement covers formulation, precursor synthesis, and ultra-high-purity filtration, and also ends the pending IPR2025-00267 patent review.

Power SemiconductorsEntegrisJSR

News

U.S. SEC: Full Rescission of Climate Disclosure Rule Proposed

The U.S. Securities and Exchange Commission (SEC) formally proposed on May 29, 2026 to rescind in full the climate disclosure rule adopted in March 2024. The rule covered GHG emissions, climate risk management, and financial effects of severe weather. The SEC says the rule exceeds its statutory authority; enforcement has been stayed since April 2024.

SustainabilitySECClimate Disclosure

News

TDK: micro POL 'FS3303' Enters Mass Production

TDK began mass production of the ultra-compact 'FS3303' micro POL DC-DC module for AI edge devices on May 19, 2026. The 2.5x2.5mm, 1.2mm-high module delivers 3A, reaches about 95% peak efficiency, and supports 2.7-6V input and 0.4-3.3V output rails.

Power SemiconductorsTDKmicro POL

News

California SB 253: Scope 1-3 Disclosure Mandated

California SB 253 requires companies with more than $1 billion in revenue and business activity in the state to disclose Scope 1-3 emissions annually. CARB formally approved the regulation in February 2026 and set the first-year Scope 1/2 reporting deadline for August 10, 2026. Out-of-state and non-U.S. companies may also be affected.

SustainabilityCaliforniaSB253

News

Microchip: 3.3kV SiC Module HV-D3 Announced

Microchip announced the 3.3kV SiC power module 'HV-D3 mSiC' on May 26, 2026. With 6kV isolation, it can cut the number of series devices by about half versus lower-voltage SiC for 13.8kV and 34.5kV grid connections, covering 100-300A for AI data center solid-state transformers (SSTs).

Power SemiconductorsMicrochipSiC

News

AIXTRON: FY2026 Guidance Raised on 30% Order Growth

AIXTRON released its Q1 2026 preliminary results, with order intake reaching approximately €171 million (+30% YoY), driven by surging data-center optical communications demand. The company raised its FY2026 full-year revenue guidance from approximately €520 million to approximately €560 million.

Power SemiconductorsAIXTRONMOCVD

News

WFE: Transition Equity Classification Principles Draft

The World Federation of Exchanges (WFE) released the 'Draft WFE Transition Equity Principles' on May 26, 2026. The framework defines how exchanges can classify companies that are not yet green but are on a transition pathway toward climate targets, aiming to channel capital flows into transition finance.

SustainabilityWFEtransition finance

News

Toshiba: 1200V SiC MOSFET TW007D120E with Enhanced FOM

Toshiba Device & Storage commenced test sample shipments of its 1200V trench-gate SiC MOSFET 'TW007D120E' on May 20, 2026. The device achieves approximately 52% improvement in the figure of merit Rds(on)×Qgd compared to current products, with the company targeting adoption in AI data center power supplies and renewable energy equipment.

Power SemiconductorsToshibaSiC MOSFET

News

Vietnam: Decree 180 on Forest Carbon Credits July 2026

Vietnam's government has promulgated Decree No. 180/2026/ND-CP, mandating a floor price, Ministry of Agriculture and Rural Development verification requirements, and double-counting prevention locks for forest carbon credit trading. With enforcement beginning July 2026, Southeast Asia's leading carbon market — backed by 14.87 million hectares of forest — establishes its regulatory foundation.

SustainabilityVietnamforest carbon

News

Mitsubishi: 1200V NX IGBT Sample Cuts Loss by 19%

Mitsubishi Electric has begun sample shipments of its 8th-generation NX-type 1200V IGBT modules in May 2026. The new modules reduce power loss by up to 19% compared to the previous generation, targeting adoption in industrial inverters, UPS systems, and solar power generation systems.

Power SemiconductorsMitsubishi ElectricIGBT

News

TISFD: Beta 0.1 Release for Social Inequality Disclosure

The Taskforce on Inequality and Social-related Financial Disclosures (TISFD) released Beta Version 0.1 on May 26, 2026. The framework is designed to disclose human capital, human rights, and inequality across four dimensions — impacts, dependencies, risks, and opportunities — and is aligned with TCFD and TNFD.

SustainabilityTISFDsocial disclosure

News

Rohm: 750V SiC MOSFET SCT4013DLL Replaces IGBT in BBUs

ROHM's TOLL-package 750V SiC MOSFET 'SCT4013DLL', entering mass production in September 2025, is gaining traction in BBU (Battery Backup Unit) applications for AI servers. This article covers the adoption drivers and key specifications.

Power SemiconductorsROHMSiC MOSFET

News

New Zealand: Mandatory Climate Disclosure via NZ CS 1

An overview of the entities subject to the Aotearoa New Zealand Climate Standards developed by the XRB, and the three-scenario analysis requirements under NZ CS 1. Examines the framework's design characteristics in comparison with the EU CSRD and IFRS S2.

SustainabilityXRBNew Zealand

News

FSA: Independent Assurance and ISSA 5000 for SSBJ

On May 19, 2026, Japan's Financial Services Agency amended the SSBJ notice to align its effective date with the ISSA 5000 adoption date (March 13). On May 25, the newly established Assurance Subcommittee held its inaugural meeting, marking a concrete step toward formalizing independent assurance frameworks for sustainability disclosure in Japan.

SustainabilitySSBJISSA5000

News

India: SEBI, NISM, IICA Sign MOU on ESG/BRSR Disclosure

India's NISM and IICA signed a May 19, 2026 MOU to build ESG/BRSR disclosure capacity and support MSME capital market access.

SustainabilitySEBIBRSR

News

World Bank: Carbon Pricing Trends 2026 and Market Growth

The World Bank says 87 carbon pricing tools now cover 29% of global GHG emissions, with 2025 government revenue above $107 billion.

Sustainabilitycarbon pricingWorld Bank

News

AI Data Centers: Recovery Signs in onsemi/Infineon Q1-Q2

Common trends from onsemi Q1 2026 and Infineon Q2 FY2026 earnings. As power demand for AI data centers expands rapidly, automotive applications remain in recovery. A breakdown of the two-axis structural shift that design and procurement teams should understand.

Data Center PoweronsemiInfineon

News

ESRS 2.0: Public Consultation Opens on Simplified Draft

The European Commission opened consultation on ESRS 2.0, a simplified CSRD standards draft with implications for EU supply chain reporting.

Sustainabilitysustainability reportingregulation

News

Germany: €5B CCfD Scheme for Industrial Decarbonization

In spring 2026, the European Commission formally approved €5 billion in state aid for Germany's industrial decarbonization program 'Klimaschutzverträge (Climate Protection Contracts).' Targeting three sectors where European carbon costs weigh most heavily — steel, chemicals, and cement — the scheme's core mechanism addresses the barriers that prevent companies from committing to decarbonization investments.

SustainabilitydecarbonizationCBAM

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Infineon: FY2026 Q2 Growth Driven by AI, GaN, and SiC

Raising full-year guidance is a decision semiconductor manufacturers handle with care. In an industry repeatedly caught off guard by inventory corrections and demand misreads, an upward revision to the outlook ripples not just through share prices but across the entire supply chain. Here is the context behind Infineon Technologies making that call in its FY2026 Q2 earnings report.

Power SemiconductorsInfineonGaN

News

World Bank: Carbon Pricing Covers One-Third of Emissions

According to the World Bank, carbon pricing policies currently cover approximately one-third of global emissions. This is a significant indicator of the widespread adoption of carbon pricing as a climate change mitigation measure.

Sustainabilitycarbon pricingemissions

News

CBAM: India Aluminum Exports Fall 41.7% on Carbon Costs

Following the full enforcement of the EU CBAM, India's unalloyed aluminum exports to the EU fell 41.7% in a single year. Drawing on the first quantitative data showing carbon costs materializing as real trade costs, we examine the structural risks now facing manufacturers.

SustainabilityCBAMIndia

News

Doosan Acquires SK Siltron: SiC Wafer Supply Shift 2026

Doosan acquires 100% of SK Siltron for ~5 trillion KRW. We assess the SiC wafer vertical-integration play despite a 414bn KRW impairment and covenant risk.

Power SemiconductorsSiCSiC wafer

News

SSBJ & CBAM: Dual 2026 Mandate for Disclosure/Carbon Cost

SSBJ disclosure and CBAM carbon costs both take effect in 2026. Shared supply chain emissions data will determine response efficiency.

SustainabilitySSBJISSB

News

India Semis: Tata-ASML Partnership and First Fab Launch

In May 2026, Tata Electronics and ASML signed a memorandum of understanding, bringing India's first advanced semiconductor fab closer to reality. From the $11 billion Dholera fab to the participation of Japanese firms including ROHM, India's supply chain buildout is moving from 'vision' to 'execution.'

Power SemiconductorsIndiasemiconductor fab

News

Cyient Announces India's First GaN Power ICs

Cyient has unveiled 650V GaN power ICs targeting AI, telecommunications, fast charging, and e-mobility applications. These ICs deliver improved power efficiency and contribute to enhanced performance in next-generation applications.

Power SemiconductorsGaNpower IC

News

GaN Market: Navitas Earnings and India Mass Production

Navitas Semiconductor's Q1 2026 earnings beat expectations, driving a surge in its stock price, underscoring the market success of its GaN technology.

Power SemiconductorsGaNFinancial Results

News

Rohm: ¥158.4B SiC Impairment Loss and Industry Reform

ROHM recorded an impairment loss of ¥193.6 billion in its power semiconductor business for the fiscal year ending March 2025, resulting in a net loss of ¥158.4 billion, primarily due to impairments on fixed assets in the SiC business.

Power SemiconductorsPower SemiconductorsSiC

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SSBJ: 3 Key Preparations for Suppliers by April 2027

Sosius has launched a free AI diagnostic tool, "SSBJ...", for companies listed on the Tokyo Stock Exchange Prime, in preparation for the Sustainability Standards Board of Japan (SSBJ) disclosure standards (applicable from the April 2027 period), enabling companies to easily assess their disclosure readiness.

SustainabilitySustainability DisclosureAI

News

CBAM: Carbon Cost Guide for Japan Steel and Chemical Firms

The EU Carbon Border Adjustment Mechanism (CBAM) entered full implementation in January 2026. With six sectors covered — steel, aluminum, fertilizers, cement, hydrogen, and electricity — Japanese exporters face requirements to calculate and declare embedded emissions. This article examines the current state of compliance and the key practical issues at stake.

SustainabilityCBAMEurope

News

CSRD/CSDDD: EU Customer Compliance

CSRD and CSDDD can reach suppliers through EU customer questionnaires, contract clauses, and disclosure requests. This article maps priority actions.

SustainabilityCSRDCSDDD

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AI Data Center Power Devices 2026: SiC/GaN UPS & PSU Demand

Generative-AI data centers are driving SiC/GaN UPS and PSU adoption as efficiency rules tighten. 2026 power-device demand trends and what they mean.

Data Center PowerData CenterPower Semiconductors

News

Green Hydrogen Cost Trends 2026: Production Cost per kg

Green hydrogen production cost per kg in 2026 still runs 3–4x grey hydrogen. How falling renewables and electrolyzer scale-up are closing the gap.

SustainabilityGreen HydrogenDecarbonization

News

How GX-ETS Phase 2 Ripples Down to Mid-Tier Suppliers

GX-ETS Phase 2 affects more than 300-400 direct participants. This article maps how Scope 3 data requests reach mid-tier suppliers.

SustainabilityGX-ETSJapan

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Internal Carbon Pricing: Embedding Carbon Costs in Business

Internal Carbon Pricing embeds carbon costs into investment, supplier evaluation, and product design decisions before external rules arrive.

SustainabilityInternal Carbon PriceCarbon Pricing

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SiC Market 2026: Demand Shift to Industrial as EV Slows

SiC demand is shifting from EV to industrial, solar, and data centers as EV growth slows. What the structural change means for supplier portfolios.

Power SemiconductorsSiCEV

News

TNFD: Nature-Related Risk Disclosure for Manufacturers

TNFD (Taskforce on Nature-related Financial Disclosures) published its final recommendations in 2023, establishing a framework for disclosing nature-related risks in biodiversity, water, land, and ocean. This article organizes how this framework — often described as the natural counterpart to TCFD — applies to manufacturer supply chain assessment.

SustainabilityTNFDBiodiversity

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Wide Bandgap Cost Roadmap: 8-inch SiC & GaN-on-Si (2026)

8-inch SiC wafers and GaN-on-Si epitaxy are reshaping wide-bandgap cost curves. When the gap versus silicon narrows, and the key cost-down factors.

Power SemiconductorsSiCGaN

News

BYD Expands 1200V SiC Output for In-House EV Inverters

BYD Semiconductor is scaling 1200V SiC MOSFET output for its own EV inverters — the world's largest EV maker moving upstream into power semiconductors.

Power SemiconductorsBYDEV

News

Fuji Electric Unveils Next-Generation IGBT

As the mid-2020s saw increasing pronouncements of silicon IGBTs becoming obsolete, Fuji Electric unveiled its next-generation IGBTs. Positioned by the company as "8th generation," these devices reportedly achieve significant improvements over conventional models in both switching loss and on-voltage, poised to revolutionize EV inverters.

Power SemiconductorsIGBT富士電機

News

Infineon CoolSiC Product Lineup Updates

Infineon's CoolSiC update should be read through voltage coverage, gate structure, short-circuit margin, and driver fit.

Power SemiconductorsInfineonSiC

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Infineon-SK Siltron SiC Wafer Deal Cuts Risk

Infineon signed a multi-year SiC wafer deal with SK Siltron in 2025, securing supply as the SiC wafer chain shifts to long-term contracts.

Power SemiconductorsInfineonSK Siltron

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Japanese Power Semiconductor Trio's Integration Progress

The "consolidation of three Japanese power semiconductor firms" concept, repeatedly reported since 2025, has garnered attention as a state-backed restructuring initiative supported by Japan's Ministry of Economy, Trade and Industry; however, tracking the movements of the involved companies reveals that the outline of the consolidation remains vague, prompting a need to clarify what has been decided and what remains undecided in the current situation.

Power SemiconductorsJapanmarket restructuring

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Mitsubishi Electric: 8-inch SiC Substrates with Coherent

Mitsubishi Electric and Coherent, a leading player in optical components and semiconductor materials, have agreed to jointly develop 8-inch (200mm) SiC wafers, marking a pivotal shift from the current 6-inch (150mm) standard that will fundamentally alter manufacturing cost structures by increasing chip yield per wafer.

Power Semiconductors8-inch SiCCoherent

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onsemi SiC Business Performance Outlook

As 2025 begins, a prevailing view is that onsemi's SiC business is not growing as much as market expectations, with its SiC business, primarily for EV inverters, facing headwinds from the slowing electrification pace in Europe and the US, leading to a series of downward revisions to full-year forecasts. However, the company remains unwavering in its SiC investment strategy, a stance of "standing firm" that...

Power SemiconductorsSiConsemi

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Renesas Acquires Transphorm GaN Business

Renesas Electronics has agreed to acquire Transphorm, a pioneer in GaN-on-SiC vertical GaN structures, in a deal set to fundamentally transform its power semiconductor portfolio in 2025.

Power SemiconductorsGaNM&A

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Renesas: 10-Year SiC Wafer Supply Deal with Wolfspeed

Renesas and Wolfspeed's 10-year SiC wafer agreement shows how supply, wafer quality, and 8-inch migration are becoming strategic assets.

Power SemiconductorsRenesasSiC

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STMicroelectronics Ampere SiC Power Modules for EV 2026

STMicroelectronics and Ampere are targeting 2026 commercialization of SiC power modules for next-generation EV traction inverters.

Power SemiconductorsAmpereEV

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STMicroelectronics SiC New Fab: Mass Production Progress

STMicroelectronics aims to capture EV and industrial demand by incrementally expanding its SiC power semiconductor fab in Catania, Italy, a move that, considering the scale and timing of investment and the pressure to monetize its SiC business, signals more than just a capacity increase.

Power SemiconductorsEVSTMicroelectronics

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Toshiba: Triple-Gate IGBT Reduces Power Loss by 40%

Toshiba announces new "Triple-Gate IGBT" structure, capable of up to 40% loss reduction compared to conventional devices; this 40% improvement signifies more than a generational spec upgrade, as in industrial equipment, railways, and large inverters, the primary battlegrounds for IGBTs, even a 1% loss reduction directly impacts system cooling costs and annual electricity expenses.

Power SemiconductorsIGBTToshiba